At the MID Days you will be informed about the research projects of the Research Association 3-D MID and gain insights into projects of our industrial partners. The event is open to all MID-interested parties and free of charge.
The MID Day takes place once a quarter in the afternoon from 4 to 5 PM CET via Zoom. There will be two presentations of 20 minutes each, followed by a Q&A session of about 10 minutes. Finally, speakers and participants can network in small groups. The event will be in English.
Registration
After your free registration you will receive the access data for the online event by e-mail.
Picture: Bright MIDster; Source: 3-D MID
11th MID Day
- 9th August 2023
- 4:00 PM – 5:00 PM (CEST)
- online
- free of charge
1st Presentation
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2nd Presentation
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Past MID Days
The presentations of the past MID Days are available to our members free of charge in the members’ area.
1st Presentation
MIDs in Aviation – Challenges and Solutions in the Research Project Effect
M.Eng. Niklas Piechulek, Chair FAPS (FAU Erlangen-Nürnberg)
2nd Presentation
Three-dimensional Function Integration: from Microwave Sintering to Agricultural Systems of the Future
Laser-assisted process for selective metallization of epoxy resin-based duromers to increase integration density for three-dimensional mechatronic package assemblies
1st Presentation
Research Project “MERLIN” – Smart wireless MID sensor systems for IoT applications
2nd Presentation
WeLDS – New possibilities for LDS through Laser Transmission Welding
Tobias Jaus, LPKF Laser & Electronics AG
Find out more about the two presentations here.
1st Presentation
Laser Direct Structured Circuits on Silicone
Dr. David Bowen, Laboratory for Physical Sciences, University of Maryland, USA
2nd Presentation
Research Project “INFINITE” – Integrative functional expansion in electrical engineering for the automated production of intelligent insulation systems
Maximilian Kneidl, Institute for Factory Automation and Production Systems (FAPS), FAU Erlangen-Nuremberg, GER
Find out more about the two presentations here.
1st Presentation
TESCAN Dynamic micro-CT Pushing the temporal and spatial boundaries for “true” in situ experimentation
Dr. Kathrin Rudolph, TESCAN GmbH
2nd Presentation
Research project “Ampec” – Additive manufacturing of power electronic circuit carriers
Thomas Stoll, Institute for Factory Automation and Production Systems (FAPS) of the FAU Erlangen-Nuremberg
Find out more about the two presentations here.
1st Presentation
Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer
2nd Presentation
Evolution of MID plating from conventional MID processing to semiconductor EMC and IME plating
Richard Retallick, MacDermid Alpha
3rd Presentation
Research project „AVerdi“ – Alternative compression processes for inks containing nanoparticles printed with digital printing processes for MID and chip cards
1st Presentation
Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer
2nd Presentation
3D-MID and the hardware innovation launching from North America
William Slade, Brayden Technical Agency LLC
3rd Presentation
Research project „3D Copperprint“ – Generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers
Ejvind Olsen, Leibniz University Hannover – ITA
To the article about the review of the 4th MID Day
1st Presentation
Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer
2nd Presentation
EU project Penta “AMPERE” – development of reliable and scalable hybrid Additive Manufacturing methods for producing multi-functional mechatronic systems
Neotech AMT GmbH, Dr. Martin Hedges
3rd Presentation
Research project “Ressiar” – manufacturing individual sensor systems in small batches
Fraunhofer Institute for Mechatronic System Designs (IEM) & University of Applied Sciences Ostwestfalen-Lippe
Lecturer: Fraunhofer IEM, Dipl.-Ing. Thomas Mager
To the article about the review of the 3rd MID Day
1st Presentation
Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer
2nd Presentation
LPKFs AMP Technology – Challenges of rewiring in the packaging area
3rd Presentation
Research project “OLE-3D”: Digital printing of organic optoelectronics on a 3D body
Chair FAPS of FAU, Mohd Khairulamzari Hamjah
To the article about the review of the 2nd MID Day
1st Presentation
Research project “AgOn3D”: Silver sintering on 3D ceramic substrates for electronics in high-temperature applications
Chair FAPS of FAU, Alexander Hensel
2nd Presentation
Research project “LaDi-Print”: Fast and flexible production of conductor structures for the production of large-area mechatronic components using laser-assisted direct printing
Chair FAPS of FAU, Simone Neermann
To the article about the review of the 1st MID Day