Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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MID Days

At the MID Days you will be informed about the research projects of the Research Association 3-D MID and gain insights into projects of our industrial partners. The event is open to all MID-interested parties and free of charge.

 

The MID Day takes place once a quarter in the afternoon from 4:00 to 5:30 PM CE(S)T via Zoom. There will be two presentations of 20 minutes each, followed by a Q&A session of about 10 minutes. Finally, speakers and participants can network in the Zoom Meeting. The event will be in English.

 

Registration

After your free registration you will receive the access data for the online event by e-mail.

Picture: Bright MIDster; Source: 3-D MID

12th MID Day

  • 8th November 2023
  • 4:00 PM – 5:30 PM (CET)
  • online via Zoom Meeting
  • free of charge

 

Download Calendar Invitation

1st Presentation

title tba

Prof. Dr.-Ing. Holger Borcherding, Technische Hochschule Ostwestfalen-Lippe

 

2nd Presentation

tba

Next MID Days

Dates will be published soon

See also event calendar

Past MID Days

The presentations of the past MID Days are available to our members free of charge in the members’ area.

1st Presentation

Challenges Associated with Additive Manufacturing of Ceramic Components

Dr.-Ing. Zongwen Fu, Research Institute for Glass Ceramics Höhr-Grenzhausen (GER)

 

2nd Presentation

Research project “PrInterfaces” – Technologies for high-quality contacting of printed structures for the establishment of level 3 connections between electronic assemblies

Michael Hümmer, TH Nuremberg (GER)

1st Presentation

MIDs in Aviation – Challenges and Solutions in the Research Project Effect

M.Eng. Niklas Piechulek, Chair FAPS (FAU Erlangen-Nürnberg)

 

2nd Presentation

Three-dimensional Function Integration: from Microwave Sintering to Agricultural Systems of the Future

Prof. Dr. Christian Dreyer, TH Wildau and Fraunhofer IAP

Laser-assisted process for selective metallization of epoxy resin-based duromers to increase integration density for three-dimensional mechatronic package assemblies

Dr.-Ing. Timo Kordass

1st Presentation

Research Project “MERLIN” – Smart wireless MID sensor systems for IoT applications

Florian Pape, Fraunhofer IEM

 

2nd Presentation

WeLDS – New possibilities for LDS through Laser Transmission Welding

Tobias Jaus, LPKF Laser & Electronics AG

 

Find out more about the two presentations here.

1st Presentation

Laser Direct Structured Circuits on Silicone

Dr. David Bowen, Laboratory for Physical Sciences, University of Maryland, USA

 

2nd Presentation

Research Project “INFINITE” – Integrative functional expansion in electrical engineering for the automated production of intelligent insulation systems

Maximilian Kneidl, Institute for Factory Automation and Production Systems (FAPS), FAU Erlangen-Nuremberg, GER

 

Find out more about the two presentations here.

1st Presentation

TESCAN Dynamic micro-CT Pushing the temporal and spatial boundaries for “true” in situ experimentation

Dr. Kathrin Rudolph, TESCAN GmbH

 

2nd Presentation

Research project “Ampec” – Additive manufacturing of power electronic circuit carriers

Thomas Stoll, Institute for Factory Automation and Production Systems (FAPS) of the FAU Erlangen-Nuremberg

Find out more about the two presentations here.

1st Presentation

Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer

 

2nd Presentation

Evolution of MID plating from conventional MID processing to semiconductor EMC and IME plating

Richard Retallick, MacDermid Alpha

 

3rd Presentation

Research project „AVerdi“ – Alternative compression processes for inks containing nanoparticles printed with digital printing processes for MID and chip cards

Jewgeni Roudenko, TH Nuremberg

1st Presentation

Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer

 

2nd Presentation

3D-MID and the hardware innovation launching from North America

William Slade, Brayden Technical Agency LLC

 

3rd Presentation

Research project „3D Copperprint“ – Generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers

Ejvind Olsen, Leibniz University Hannover – ITA

 

To the article about the review of the 4th MID Day

1st Presentation

Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer

 

2nd Presentation

EU project Penta “AMPERE” – development of reliable and scalable hybrid Additive Manufacturing methods for producing multi-functional mechatronic systems

Neotech AMT GmbH, Dr. Martin Hedges

 

3rd Presentation

Research project “Ressiar” – manufacturing individual sensor systems in small batches

Fraunhofer Institute for Mechatronic System Designs (IEM) & University of Applied Sciences Ostwestfalen-Lippe

Lecturer: Fraunhofer IEM, Dipl.-Ing. Thomas Mager

 

To the article about the review of the 3rd MID Day

1st Presentation

Introduction of 3-D MID and current research topics
3-D MID, Philipp Braeuer

 

2nd Presentation

LPKFs AMP Technology – Challenges of rewiring in the packaging area

LPKF, Florian Roick

 

3rd Presentation

Research project “OLE-3D”: Digital printing of organic optoelectronics on a 3D body

Chair FAPS of FAU, Mohd Khairulamzari Hamjah

 

To the article about the review of the 2nd MID Day

1st Presentation

Research project “AgOn3D”: Silver sintering on 3D ceramic substrates for electronics in high-temperature applications
Chair FAPS of FAU, Alexander Hensel

 

2nd Presentation

Research project “LaDi-Print”: Fast and flexible production of conductor structures for the production of large-area mechatronic components using laser-assisted direct printing
Chair FAPS of FAU, Simone Neermann

 

To the article about the review of the 1st MID Day

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