23. September 2022 ECPE e.V.: New member of 3-D MID e.V. Read more 29. August 2022 Introduction of the project outline: Generation of Spatial Circuit Carriers Using Laser-Induced Direct Metallization of Industrially Established Ceramics [EdDing] Read more 1. August 2022 Invitation to the MID Summit & MID Workshop 2022 Read more 1. July 2022 Introduction of the Research Project “Laser Direct Structured Circuits on Silicone” Read more 15. June 2022 Invitation to the 7th MID Day – LDS on silicone & intelligent insulation systems Read more 13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more 10. June 2022 Smart wireless MID sensor systems for IoT applications (MERLIN) Read more 8. June 2022 Jürgenhake as a New Member of the Research Association Read more 30. May 2022 Promoting innovation more strongly through ZIM funding Read more 24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more 18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more 2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more 1 2 … 9 Next
29. August 2022 Introduction of the project outline: Generation of Spatial Circuit Carriers Using Laser-Induced Direct Metallization of Industrially Established Ceramics [EdDing] Read more
1. July 2022 Introduction of the Research Project “Laser Direct Structured Circuits on Silicone” Read more
15. June 2022 Invitation to the 7th MID Day – LDS on silicone & intelligent insulation systems Read more
13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more
24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more
18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more
2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more
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