2. May 2023 Invitation to the 10th MID Day on May 10 – MIDs in Aviation & 3D Function Integration Read more 7. March 2023 Successful Exhibition Booth at LOPEC 2023 Read more 16. February 2023 Review of the 9th MID Day on 8th February Read more 8. February 2023 New Funding Guideline for Industrielle Gemeinschaftsforschung Comes into Force as of 1/1/2023 Read more 31. January 2023 Invitation to the 9th MID Day – selective metallization & contacting of printed structures Read more 19. January 2023 Introduction of the project outline: 3D alignment and optical coupling of diodes to substrate-based optical fibers using mechatronic integrated device submounts [3D-OKMID] Read more 4. January 2023 Preview of the Research Association’s activities in 2023 Read more 1. December 2022 Our new member ALUMINA SYSTEMS GmbH introduces itself Read more 23. October 2022 Invitation to the 8th MID Day – Laser transmission welding of LDS plastics & Smart Wireless MID Sensor Systems Read more 7. October 2022 Review of the MID Summit & MID Workshop 2022 Read more 23. September 2022 ECPE e.V.: New member of 3-D MID e.V. Read more 29. August 2022 Introduction of the project outline: Generation of Spatial Circuit Carriers Using Laser-Induced Direct Metallization of Industrially Established Ceramics [EdDing] Read more 1 2 … 10 Next
2. May 2023 Invitation to the 10th MID Day on May 10 – MIDs in Aviation & 3D Function Integration Read more
8. February 2023 New Funding Guideline for Industrielle Gemeinschaftsforschung Comes into Force as of 1/1/2023 Read more
31. January 2023 Invitation to the 9th MID Day – selective metallization & contacting of printed structures Read more
19. January 2023 Introduction of the project outline: 3D alignment and optical coupling of diodes to substrate-based optical fibers using mechatronic integrated device submounts [3D-OKMID] Read more
23. October 2022 Invitation to the 8th MID Day – Laser transmission welding of LDS plastics & Smart Wireless MID Sensor Systems Read more
29. August 2022 Introduction of the project outline: Generation of Spatial Circuit Carriers Using Laser-Induced Direct Metallization of Industrially Established Ceramics [EdDing] Read more
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