Research Association Molded Interconnect Devices 3-D MID e.V.
The aims of the Research Association 3-D MID is to promote, further develop and market MID technologies.
Through joint industrial research and targeted knowledge transfer the technologies are constantly developed to further increase the market position of our members. The biennial MID Congress and the trade fair presences serve to market the MID technologies. The networking among the members promotes competitiveness through comprehensive cooperation and exchange.
- Congress MID 2021
Register for the Congress MID from February 9th to 10th 2021 in the Amberg Congress Centre.
Find out about our current and completed industry-related research projects within the AiF.
Take part in one of the many events related to MID technologies.
Enjoy the many advantages of membership in the Research Association.