PLEASE NOTE: As all research is carried out in German, detailed information about the projects is unfortunately not available in English.
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(IGF = joint industrial research)
Characterization methods for determining the sintering properties of printed inks containing micro- and nanoparticles and their influence on the homogeneity of conductivity and reliability (SIMONE)
Duration: 01/01/2020 – 12/31/2021
The aim of the research project is to develop a new electrical characterization method for the analysis of sintered highly conductive nano- and microparticle inks. On the one hand, statements can be made about adhesion, crack formation, current carrying capacity as well as the profile of the conductivity over the cross section and high-frequency relevant surface properties. On the other hand, the exact knowledge of the influence of the sintering parameters is a prerequisite for a later economic use of the material and process combinations.
Production of individual sensor systems in small lot sizes
Duration: 07/01/2018 – 12/31/2020
Objective: The project will enable small and medium-sized enterprises to take their first steps in the areas of design, manufacturing, testing and commissioning in the retrofit of systems with smart sensor systems. A library will be developed to allow less experienced developers to identify application-specific retrofit strategies, to configure spatially integrated sensor systems, and to integrate the developed sensor systems into existing production systems.
Generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers
Duration: 07/01/2018 – 09/30/2020
Objective: Development of a cost-effective and resource-saving process for the deposition of copper conductors.
Fast and flexible production of conductor structures for the production of large-area mechatronic components by laser-assisted direct printing
Duration: 07/01/2018 – 06/30/2020
Objective: Due to the feasibility of large-area MID components, electrical functions can be applied to already existing components, whereby the integration density can be further increased or the product weight can be further reduced.
Silver sintered on 3D ceramic substrates for electronics in high temperature applications
Duration: 06/01/2018 – 05/31/2020
Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.
Additive manufacturing of power electronic circuit carriers
Duration: 05/01/2018 – 04/30/2021
Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.