Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Current Projects

Below you will find a summary of the current projects. By clicking on the project name you will receive further information on the particular project.


The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.


Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office. E-Mail to office


IGF = Industrial Collective Research

Please find more information about IGF here.

IGF Project 21173 N – PrESens

Additive manufacturing for the integration of sensor technology into mechatronic systems


Duration: 10/01/2020 – 09/31/2022


Objective: In the PrESens project, technologies and process sequences are developed with which sensor structures can be integrated directly into mechatronic systems by means of additive manufacturing processes. The focus is on the use of innovative printing processes to create functional structures on the individual components of the systems.

IGF Project 21241 N – MiniHelix

Miniaturization of helix antennas for HF applications by MID manufacturing process [MiniHelix]


Duration: 05/01/2020 – 04/30/2022


In the MiniHelix project, future-oriented manufacturing processes for mechatronic integrated assemblies (3d MID) are being investigated in the context of antenna applications. The aim of the project is to develop additive manufacturing processes for antenna arrays made of multifilar helix antennas.

IGF Project 21135 BG – MikSin

Sintering of printed conductive structures by energy input using microwave irradiation (MikSin)


Duration: 04/01/2020 – 03/31/2022


On the one hand, the expected project results extend the spectrum of printable substrates to include low-polar and at the same time temperature-sensitive materials, thus opening up the possibility of expanding the range of products containing printed conductive structures. Furthermore, a faster and more energy-efficient sintering process can be assumed, since energy only has to be introduced into the printed structures and not the entire component and the complete sintering furnace has to be heated.

IGF Project 20928 N – SIMONE

Characterization methods for determining the sintering properties of printed inks containing micro- and nanoparticles and their influence on the homogeneity of conductivity and reliability (SIMONE)


Duration: 01/01/2020 – 12/31/2021


The aim of the research project is to develop a new electrical characterization method for the analysis of sintered highly conductive nano- and microparticle inks. On the one hand, statements can be made about adhesion, crack formation, current carrying capacity as well as the profile of the conductivity over the cross section and high-frequency relevant surface properties. On the other hand, the exact knowledge of the influence of the sintering parameters is a prerequisite for a later economic use of the material and process combinations.

IGF-CORNET Project 231 EN – Ressiar MID 

Production of individual sensor systems in small lot sizes


Duration: 07/01/2018 – 12/31/2020


Objective: The project will enable small and medium-sized enterprises to take their first steps in the areas of design, manufacturing, testing and commissioning in the retrofit of systems with smart sensor systems. A library will be developed to allow less experienced developers to identify application-specific retrofit strategies, to configure spatially integrated sensor systems, and to integrate the developed sensor systems into existing production systems.

IGF Project 20133 N – 3D Copperprint

Generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers


Duration: 07/01/2018 – 09/30/2020


Objective: Development of a cost-effective and resource-saving process for the deposition of copper conductors.

IGF Project 20202 N – LaDi-Print

Fast and flexible production of conductor structures for the production of large-area mechatronic components by laser-assisted direct printing


Duration: 07/01/2018 – 06/30/2020


Objective: Due to the feasibility of large-area MID components, electrical functions can be applied to already existing components, whereby the integration density can be further increased or the product weight can be further reduced.

IGF Project 20132 N – AgOn3D

Silver sintered on 3D ceramic substrates for electronics in high temperature applications


Duration: 06/01/2018 – 05/31/2020


Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.

IGF Project 20144 N – Ampec

Additive manufacturing of power electronic circuit carriers


Duration: 05/01/2018 – 04/30/2021


Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.

IGF-Project 19854 N – OLE-3D

Digital printing of organic optoelectronics on a 3D body


Duration: 01/01/2018 – 06/30/2020


Objective: Development of processes for the production of organic functional layers on 3D surfaces of any shape. To this end, materials, processing methods and equipment technology for digital printing technologies such as inkjet and aerosol jet are to be further developed and the organic electronic devices (OEDs) produced are to be combined with 3D-Molded Interconnect Devices (3D-MID) technology.

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