PLEASE NOTE: As all research is carried out in German, detailed information about the projects is unfortunately not available in English.
If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site.
The results of the individual working groups are available as members exclusives here.
(IGF = joint industrial research)
Production of individual sensor systems in small lot sizes
Duration: 01.07.2018 – 30.06.2020
Objective: The project will enable small and medium-sized enterprises to take their first steps in the areas of design, manufacturing, testing and commissioning in the retrofit of systems with smart sensor systems. A library will be developed to allow less experienced developers to identify application-specific retrofit strategies, to configure spatially integrated sensor systems, and to integrate the developed sensor systems into existing production systems.
Research on the production of injection-moulded, thermoset circuit carriers using the LDS technology
Duration: 01st July 2016 – 31st December 2018
Objective: Development of novel thermosetting LDS materials for the injection moulding process, for the production of microstructured MID on a thermoset basis by means of laser direct structuring.
Development of a ceramic injection-moulded 3D circuit carrier for the connection and integration of power electronics by means of low-resistance active solders
Duration: 01st October 2016 – 31st March 2019
Objective: Development of methods and the options to implement active solder-based electrical conductor paths in and onto ceramic injection-moulded structures, in order to enable contacting and integration of power electronic components.
Generation of 3D functional structures for high-frequency applications by printing processes
Duration: 01st November 2016 – 31st December 2018
Objective: By using 3D printing processes for the generation of functional structures for high-frequency applications, the limitations of the existing circuit board production methods are supposed to be overcome and new HF-suitable manufacturing technologies established.
Alternative densification processes for digital printed nanoparticular inks used to produce planar MID
Duration: 01st July 2017 – 30th June 2019
Objective: Investigation of alternative densification processes and optimization of the process parameters to reduce the process time and temperature and to increase the electrical conductivity of printed conductor tracks.
Digital printing of organic optoelectronics on a 3D body
Duration: 01.01.2018 to 31.12.2019
Objective: Development of processes for the production of organic functional layers, e.g. for OPV, OPD and OLED applications, on arbitrarily shaped 3D surfaces.
Additive manufacturing of power electronic circuit carriers
Duration: 01.05.2018 to 30.04.2020
Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.
Silver sintered on 3D ceramic substrates for electronics in high temperature applications
Duration: 01.06.2018 to 31.05.2020
Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.
Fast and flexible production of conductor structures for the production of large-area mechatronic components by laser-assisted direct printing
Duration: 01.07.2018 to 30.06.2020
Objective: Due to the feasibility of large-area MID components, electrical functions can be applied to already existing components, whereby the integration density can be further increased or the product weight can be further reduced.
Generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers
Duration: 01.07.2018 to 30.06.2020
Objective: Development of a cost-effective and resource-saving process for the deposition of copper conductors.