Current Projects

Below you will find a summary of the current projects. By clicking on the project name you will receive further information on the particular project.

The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.

Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office (see contact details). E-Mail to office

IGF = Industrial Collective Research

Please find more information about IGF here.

01IF23676N CoCoBatt

Qualification of the atmospheric plasma spraying process for the coating of copper current collectors on (solid-state) battery components.

Duration: 01.03.2025 – 31.08.2027

The aim is to deposit a thin copper layer non-destructively on ceramic solid electrolyte and to produce an optimized interface contact that enables repeated deposition of anode material

01IF23406N Project – PreciEye

Specifying Non-Contact Intraocular Pressure Measurement for Self-Diagnosis

The aim of the research project is to specify and validate the contactless measurement method of the self-tonometer.

01IF23410N Project – CERACLAD

Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CERACLAD]

Duration: 06/01/2023 – 05/31/2025

Research objective

The main objective of the CERACLAD research project is the direct generation of conductive structures from graded copper/copper-phosphorus systems on technical ceramics without upstream and downstream process steps by means of DED-LB/M. The copper-phosphorus material is to be used as a base layer on the ceramic due to its good wetting behavior. For high electrical conductivity, pure copper is applied in further layers. In the DED-LB/M process, two conveying lines can be continuously combined for this purpose and materials can be mixed in the process zone. The processing of CuP is additionally investigated in the PBF-LB/M process to determine the adhesion mechanisms. An infrared laser beam source is used for both processes.

IGF-Project 22982 N – MULTISENS

Passive wireless read-out sensors based on additively manufactured multi-material resonant circuits

Duration: 09/01/2023 – 08/31/2025

MultiSens is addressing these two dynamic markets and is pursuing the goal of developing fully printable passive LC sensors:

• To create basic knowledge regarding the design, performance and production of a new class of passive chipless, fully printable RFID sensors,
• to provide sensor users with a technology that enables the integration of sensors at significantly lower cost, more flexibly and with less space and weight requirements, and
• to open up a new, highly innovative field of application for companies along the value chain of printed electronics (material components/systems printing technologies) and thus generate new market opportunities.

IGF-Project 22982 N – MULTISENS

Passive wireless read-out sensors based on additively manufactured multi-material resonant circuits

Duration: 09/01/2023 – 08/31/2025

MultiSens is addressing these two dynamic markets and is pursuing the goal of developing fully printable passive LC sensors:

• To create basic knowledge regarding the design, performance and production of a new class of passive chipless, fully printable RFID sensors,
• to provide sensor users with a technology that enables the integration of sensors at significantly lower cost, more flexibly and with less space and weight requirements, and
• to open up a new, highly innovative field of application for companies along the value chain of printed electronics (material components/systems printing technologies) and thus generate new market opportunities.

CORNET-Project 360 EN – Alu4CED

Assembly and interconnection concept for the production of recyclable electronic devices based on functionalized aluminum housing shells

Duration: 10/01/2023 – 09/30/2025

With the aim of designing electronic products to be energy and material-optimized over the entire product life cycle and particularly for recycling, this research project will adapt existing MID technologies for creating electronic circuitry and antenna to a product housing concept for ICT equipment based on aluminum.

IGF-Project 22835 – MultiPower

Spatially optimised manufacture of a power module using stereolithographic multi-material fabrication of ceramic 3D substrates with embedded conductive structures

Duration: 04/01/2023 – 11/30/2024

The aim of the research project is the spatially optimised manufacture of a power electronic module with embedded conductive structures in a ceramic housing by means of additive manufacturing in order to optimise heat dissipation, minimise gate-path losses and increase component integration and functional density.

IGF-Project 22854 – SmartSeal

Intelligent shaft seals using 3D MID sensor integration

Duration: 04/01/2023 – 06/30/2025

In the research project, a sensor is to be integrated into shaft sleeves, which serve as the mating surface of radial shaft seals, by means of 3D-MID, which measures the temperature exactly under the sealing contact of the sealing edge without changing the sealing behaviour.

IGF-Project 22602 BR – INSEL

Inductive inline sintering for electrical printed conductive structures with a process control system

Duration: 08/01/2022 – 07/31/2024

Research objective:

• TUC: Inductor (induction coil) for sintering wet, printed conductor tracks with thicknesses from 30 μm and widths from 300 μm
• IWU: model-based process control for the sintering process, max.conductivity deviation ± 5%