Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Current Projects

Below you will find a summary of the current projects. By clicking on the project name you will receive further information on the particular project.


The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.


Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office (see contact details). E-Mail to office


IGF = Industrial Collective Research

Please find more information about IGF here.

IGF-Project 22982 N – MULTISENS

Passive wireless read-out sensors based on additively manufactured multi-material resonant circuits


Duration: 09/01/2023 – 08/31/2025


MultiSens is addressing these two dynamic markets and is pursuing the goal of developing fully printable passive LC sensors:

  • To create basic knowledge regarding the design, performance and production of a new class of passive chipless, fully printable RFID sensors,
  • to provide sensor users with a technology that enables the integration of sensors at significantly lower cost, more flexibly and with less space and weight requirements, and
  • to open up a new, highly innovative field of application for companies along the value chain of printed electronics (material components/systems printing technologies) and thus generate new market opportunities.

CORNET-Project 360 EN – Alu4CED

Assembly and interconnection concept for the production of recyclable electronic devices based on functionalized aluminum housing shells


Duration: 10/01/2023 – 09/30/2025


With the aim of designing electronic products to be energy and material-optimized over the entire product life cycle and particularly for recycling, this research project will adapt existing MID technologies for creating electronic circuitry and antenna to a product housing concept for ICT equipment based on aluminum.

IGF-Project 22835 – MultiPower

Spatially optimised manufacture of a power module using stereolithographic multi-material fabrication of ceramic 3D substrates with embedded conductive structures


Duration: 04/01/2023 – 11/30/2024


The aim of the research project is the spatially optimised manufacture of a power electronic module with embedded conductive structures in a ceramic housing by means of additive manufacturing in order to optimise heat dissipation, minimise gate-path losses and increase component integration and functional density.

IGF-Project 22854 – SmartSeal

Intelligent shaft seals using 3D MID sensor integration


Duration: 04/01/2023 – 06/30/2025


In the research project, a sensor is to be integrated into shaft sleeves, which serve as the mating surface of radial shaft seals, by means of 3D-MID, which measures the temperature exactly under the sealing contact of the sealing edge without changing the sealing behaviour.

IGF-Project 22602 BR – INSEL

Inductive inline sintering for electrical printed conductive structures with a process control system


Duration: 08/01/2022 – 07/31/2024


Research objective:

  • TUC: Inductor (induction coil) for sintering wet, printed conductor tracks with thicknesses from 30 μm and widths from 300 μm
  • IWU: model-based process control for the sintering process, max.conductivity deviation ± 5%

IGF-Project 22434 N – 3D-MosquitOPrint

3D optical conductors on functional surfaces using the Mosquito method


Duration: 07/01/2022 – 06/30/2024


The research objective of the project is the integration of optical fibers in cavities on 3D surfaces using the mosquito method. In addition, industrial production should be made possible.

IGF-Project 22296 N – AddiHF

Additive manufacturing of antennas by processing of high frequency plastics


Duration: 07/01/2022 – 06/30/2024


The aim of the project is to investigate suitable combinations of plastics and AF manufacturing processes of RF components.


Printed Supercaps and Batteries (Supercapatteries) for Smart Energy Storage Systems


Duration: 04/01/2022 – 03/31/2024


Research objective: Development of powerful, mass printed, 3D energy storage devices

IGF-Project 22295 BG – PrInterfaces

Technologies for high quality contacting of printed structures for level-3 interconnections between electronic assemblies


Duration: 03/01/2022 – 02/29/2024


The focus of the project is on the evaluation of the manufacturability of functional and reliable Level 3 interconnections, for which printed circuit boards have to be contacted using conventional electronics production techniques.

IGF-Project 22453 N – AMDEA

Additive manufacturing of dielectric elastomers for industrial use


Duration: 05/01/2022 – 04/30/2024

The aim of the research project is to develop industrially scalable, additive manufacturing processes for dielectric elastomers and to create corresponding parameter guidelines.

IGF-Project 21894 N – DigiTIMe

Digital printing of conductive inks using inkjet for miniaturization of electronic assemblies


Duration: 10/01/2021 – 09/30/2023


The main research objective is to test the scientific thesis that conventional stencil printing can be substituted by inkjet printing on an ink base for extremely miniaturised assemblies and at the same time integrated into the existing production environment.

IGF-Project 21862 N – NiMm3

Nickel-free metallization systems on 3D MID substrate materials


Duration: 05/01/2021 – 10/31/2023


The goal is to provide important insights for the design and manufacture of reliable 3D circuit carriers. On the other hand, new applications for MIDs with nickel-free conductor paths are also to be developed.

IGF-Project 21780 N – 3D-MLD

IGF – 3D multilayer printing from Mechatronic Integrated Devices


Duration: 04/01/2021 – 12/31/2023


In the research project applied for, the generative printing of multilayer conductor tracks with vias on spatial free-form surfaces is being researched in order to increase the integration density of 3D mechatronic integrated devices (3D-MID).

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