Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Current Projects

PLEASE NOTE: As all research is carried out in German, detailed information about the projects is unfortunately not available in English.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site.

The results of the individual working groups are available as members exclusives here.

 

(IGF = joint industrial research)

 

 

 

IGF-CORNET Projekt 231 EN – Ressiar MID 

Production of individual sensor systems in small lot sizes

 

Duration: 01.07.2018 – 30.06.2020

Objective: The project will enable small and medium-sized enterprises to take their first steps in the areas of design, manufacturing, testing and commissioning in the retrofit of systems with smart sensor systems. A library will be developed to allow less experienced developers to identify application-specific retrofit strategies, to configure spatially integrated sensor systems, and to integrate the developed sensor systems into existing production systems.

 

 

IGF Project 18374 N – Duroplast-LDS-MID

Research on the production of injection-moulded, thermoset circuit carriers using the LDS technology

 

Duration: 01st July 2016 – 31st December 2018

 

Objective: Development of novel thermosetting LDS materials for the injection moulding process, for the production of microstructured MID on a thermoset basis by means of laser direct structuring.

 

 

IGF Project 19230 N – ActivePower

Development of a ceramic injection-moulded 3D circuit carrier for the connection and integration of power electronics by means of low-resistance active solders

 

Duration: 01st October 2016 – 31st March 2019

Objective: Development of methods and the options to implement active solder-based electrical conductor paths in and onto ceramic injection-moulded structures, in order to enable contacting and integration of power electronic components.

 

 

IGF Project 19253 N – HF printing

Generation of 3D functional structures for high-frequency applications by printing processes

 

Duration: 01st November 2016 – 31st December 2018

 

Objective: By using 3D printing processes for the generation of functional structures for high-frequency applications, the limitations of the existing circuit board production methods are supposed to be overcome and new HF-suitable manufacturing technologies established.

 

 

IGF Project 19605 N – AVerdi  

Alternative densification processes for digital printed nanoparticular inks used to produce planar MID

Duration: 01st July 2017 – 30th June 2019

 

Objective: Investigation of alternative densification processes and optimization of the process parameters to reduce the process time and temperature and to increase the electrical conductivity of printed conductor tracks.

 

 

IGF Project 19854 N – OLE-3D

Digital printing of organic optoelectronics on a 3D body

 

Duration: 01.01.2018 to 31.12.2019

 

Objective: Development of processes for the production of organic functional layers, e.g. for OPV, OPD and OLED applications, on arbitrarily shaped 3D surfaces.

 

 

IGF project 20144 N – Ampec

Additive manufacturing of power electronic circuit carriers

 

Duration: 01.05.2018 to 30.04.2020

 

Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.

 

 

IGF project 20132 N – AgOn3D

Silver sintered on 3D ceramic substrates for electronics in high temperature applications

 

Duration: 01.06.2018 to 31.05.2020

 

Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.

 

 

IGF project 20202 N – LaDi-Print

Fast and flexible production of conductor structures for the production of large-area mechatronic components by laser-assisted direct printing

 

Duration: 01.07.2018 to 30.06.2020

 

Objective: Due to the feasibility of large-area MID components, electrical functions can be applied to already existing components, whereby the integration density can be further increased or the product weight can be further reduced.

 

 

IGF Project 20133 N – 3D Copperprint

Generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers

 

Duration: 01.07.2018 to 30.06.2020

 

Objective: Development of a cost-effective and resource-saving process for the deposition of copper conductors.

Contact

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Phone: +49 911 5302-9100
Fax: +49 911 5302-9102
E-Mail: info@3dmid.de

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