Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Current Projects

Below you will find a summary of the current projects. By clicking on the project name you will receive further information on the particular project.

 

The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.

 

Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office. E-Mail to office

 

IGF = Industrial Collective Research

Please find more information about IGF here.

IGF-Project – SUPERBAT

Printed Supercaps and Batteries (Supercapatteries) for Smart Energy Storage Systems [SUPERBAT]

 

Duration: 04/01/2022 – 03/31/2024

 

Research objective: Development of powerful, mass printed, 3D energy storage devices

IGF-Project 21894 N – DigiTIMe

Digital printing of conductive inks using inkjet for miniaturization of electronic assemblies (DigiTIMe)

 

Duration: 10/01/2021 – 09/30/2023

 

The main research objective is to test the scientific thesis that conventional stencil printing can be substituted by inkjet printing on an ink base for extremely miniaturised assemblies and at the same time integrated into the existing production environment.

IGF-Project 21862 N – NiMm3

Nickel-free metallization systems on 3D MID substrate materials

 

Duration: 05/01/2021 – 04/30/2023

 

The goal is to provide important insights for the design and manufacture of reliable 3D circuit carriers. On the other hand, new applications for MIDs with nickel-free conductor paths are also to be developed.

IGF-Project 21780 N – 3D-MLD

IGF – 3D multilayer printing from Mechatronic Integrated Devices

 

Duration: 04/01/2021 – 03/31/2023

 

In the research project applied for, the generative printing of multilayer conductor tracks with vias on spatial free-form surfaces is being researched in order to increase the integration density of 3D mechatronic integrated devices (3D-MID).

IGF-Project 21451 N – INFINITE

Integrative functional expansion in electrical engineering for the automated production of intelligent insulation systems [INFINITE]

 

Duration: 11/01/2020 – 10/31/2022

 

The research objective is to enable a thermoset injection moulding process for the insulation of stators for electric motors. Thereby, material advantages and the degrees of freedom of the process are to be used to produce an optimized insulation system with reduced process time compared to common processes.

IGF Project 21173 N – PrESens

Additive manufacturing for the integration of sensor technology into mechatronic systems

 

Duration: 10/01/2020 – 09/31/2022

 

Objective: In the PrESens project, technologies and process sequences are developed with which sensor structures can be integrated directly into mechatronic systems by means of additive manufacturing processes. The focus is on the use of innovative printing processes to create functional structures on the individual components of the systems.

IGF Project 21241 N – MiniHelix

Miniaturization of helix antennas for HF applications by MID manufacturing process [MiniHelix]

 

Duration: 05/01/2020 – 04/30/2022

 

In the MiniHelix project, future-oriented manufacturing processes for mechatronic integrated assemblies (3d MID) are being investigated in the context of antenna applications. The aim of the project is to develop additive manufacturing processes for antenna arrays made of multifilar helix antennas.

IGF Project 21135 BG – MikSin

Sintering of printed conductive structures by energy input using microwave irradiation (MikSin)

 

Duration: 04/01/2020 – 03/31/2022

 

On the one hand, the expected project results extend the spectrum of printable substrates to include low-polar and at the same time temperature-sensitive materials, thus opening up the possibility of expanding the range of products containing printed conductive structures. Furthermore, a faster and more energy-efficient sintering process can be assumed, since energy only has to be introduced into the printed structures and not the entire component and the complete sintering furnace has to be heated.

IGF Project 20928 N – SIMONE

Characterization methods for determining the sintering properties of printed inks containing micro- and nanoparticles and their influence on the homogeneity of conductivity and reliability (SIMONE)

 

Duration: 01/01/2020 – 12/31/2021

 

The aim of the research project is to develop a new electrical characterization method for the analysis of sintered highly conductive nano- and microparticle inks. On the one hand, statements can be made about adhesion, crack formation, current carrying capacity as well as the profile of the conductivity over the cross section and high-frequency relevant surface properties. On the other hand, the exact knowledge of the influence of the sintering parameters is a prerequisite for a later economic use of the material and process combinations.

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