Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Applied Projects

Below you will find a summary of the projects currently being applied for. By clicking on the project name you will receive further information on the particular project.

The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.

 

Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office. E-Mail to office

Project CEEE-ALU

CORNET – Circular Electrical and Electronic Equipment – The Aluminium Option [CEEE-ALU]

 

Duration: 09/01/2022 – 08/31/2024

 

The aim of the research project is to validate the suitability of aluminium as a functional housing material for small network devices. In this context, different methods and technologies, which are necessary for the success of the concept, are also examined for their feasibility.

Project 60Protect

mmWave Product Authentication with Mobile Devices and secure Cloud Service [60Protect]

 

Duration: 02/01/2022 – 01/31/2024

 

The focus of this project is on the implementation of a complete 60 GHz (mmWave) RFID system that can be used directly by SMEs for the authentication of products. Such an mmWave system consists of tiny transponders, compact, low-cost readers, secure cryptographic algorithms and a cloud-based software infrastructure.

Project SUPERBAT

Printed Supercaps and Batteries (Supercapatteries) for Smart Energy Storage Systems [SUPERBAT]

 

Duration: 01/01/2022 – 12/31/2023

 

Research objective: Development of powerful, mass printed, 3D energy storage devices

Project AddiHF

Additive manufacturing of antennas by processing of high frequency plastics (AddiHF)

 

Duration: 11/01/2021 – 10/31/2023

 

The aim of the project is to investigate suitable combinations of plastics and AF manufacturing processes of RF components.

Project FLA-HEAT

IGF – Investigation of the influence of thermally conductive fillers on flame retardant substrate materials [FLA-HEAT]

 

Duration: 11/01/2021 – 10/31/2023

 

Research Objective: Investigation of the influencing factors of thermally conductive fillers and their orientation on the flame retardant properties at different states of conditioning

Project MST-MID

Integrated Microsystems on functionalized MID polymer wafers (MST-MID)

 

Duration: 10/01/2021 – 09/30/2023

 

As a research objective, a simplified process for the manufacture of eddy current sensors is to be investigated with regard to process complexity and number of process steps. The question whether eddy current sensors can be manufactured without the use of lithography and complex packaging processes is to be answered. For this purpose, the LDS process in combination with plastic injection moulding is to provide the necessary technological foundation.

Project DigiTIMe

Digital printing of conductive inks using inkjet for miniaturization of electronic assemblies (DigiTIMe)

 

Duration: 10/01/2021 – 09/30/2023

 

The main research objective is to test the scientific thesis that conventional stencil printing can be substituted by inkjet printing on an ink base for extremely miniaturised assemblies and at the same time integrated into the existing production environment.

Project NiMm3

Nickel-free metallization systems on 3D MID substrate materials

 

Duration: 05/01/2021 – 04/30/2023

 

The planned NiMm3 project is intended to provide important insights for the design and manufacture of reliable 3D circuit carriers. On the other hand, new applications for MIDs with nickel-free conductor paths are also to be developed.

Project 3D-MLD

IGF – 3D multilayer printing from Mechatronic Integrated Devices [3D-MLD]

 

Duration: 04/01/2021 – 03/31/2023

 

Research Objective: Printing of multilayer 3D-MID with vias

Project PrInterface

Technologies for high quality contacting of printed structures for level-3 interconnections between electronic assemblies

 

Duration: 03/01/2021 – 02/28/2023

 

The focus of the proposed project is on the evaluation of the manufacturability of functional and reliable Level 3 interconnections, for which printed circuit boards have to be contacted using conventional electronics production techniques.

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