Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
+49 911 5302-9100
+49 911 5302-9102
Computer Man Member area

Applied Projects

Below you will find a summary of the projects currently being applied for. By clicking on the project name you will receive further information on the particular project.

The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.

 

Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office. E-Mail to office

Project SmartSeal

Intelligent shaft seals using 3D MID sensor integration

 

Duration: 10/01/2022 – 12/31/2024

 

In the research project, a sensor is to be integrated into shaft sleeves, which serve as the mating surface of radial shaft seals, by means of 3D-MID, which measures the temperature exactly under the sealing contact of the sealing edge without changing the sealing behaviour.

Project MultiPower

Spatially optimised manufacture of a power module using stereolithographic multi-material fabrication of ceramic 3D substrates with embedded conductive structures

 

Duration: 09/01/2022 – 08/31/2024

 

The aim of the research project is the spatially optimised manufacture of a power electronic module with embedded conductive structures in a ceramic housing by means of additive manufacturing in order to optimise heat dissipation, minimise gate-path losses and increase component integration and functional density.

Project CEEE-ALU

CORNET – Circular Electrical and Electronic Equipment – The Aluminium Option [CEEE-ALU]

 

Duration: 09/01/2022 – 08/31/2024

 

The aim of the research project is to validate the suitability of aluminium as a functional housing material for small network devices. In this context, different methods and technologies, which are necessary for the success of the concept, are also examined for their feasibility.

Project INSEL

Inductive inline sintering for electrical printed conductive structures with a process control system

 

Duration: 08/01/2022 – 07/31/2024

 

Research objective:

  • TUC: Inductor (induction coil) for sintering wet, printed conductor tracks with thicknesses from 30 μm and widths from 300 μm
  • IWU: model-based process control for the sintering process, max.conductivity deviation ± 5%

Project AMDEA

Additive manufacturing of dielectric elastomers for industrial use [AMDEA]

 

Duration: 01/01/2022 – 12/31/2023

 

The aim of the research project is to develop industrially scalable, additive manufacturing processes for dielectric elastomers and to create corresponding parameter guidelines.

Project AddiHF

Additive manufacturing of antennas by processing of high frequency plastics (AddiHF)

 

Duration: 11/01/2021 – 10/31/2023

 

The aim of the project is to investigate suitable combinations of plastics and AF manufacturing processes of RF components.

Project MST-MID

Integrated Microsystems on functionalized MID polymer wafers (MST-MID)

 

Duration: 10/01/2021 – 09/30/2023

 

As a research objective, a simplified process for the manufacture of eddy current sensors is to be investigated with regard to process complexity and number of process steps. The question whether eddy current sensors can be manufactured without the use of lithography and complex packaging processes is to be answered. For this purpose, the LDS process in combination with plastic injection moulding is to provide the necessary technological foundation.

Project SolEnc

Digital printing of solution-based encapsulation of organic electronics on 3D surfaces

 

Duration: 10/01/2021 – 09/30/2023

 

The aim of this research work is to encapsulate printed organic electronics using digital printing processes.

Project 3D-MosquitOPrint

3D optical conductors on functional surfaces using the Mosquito method

 

Duration: 09/01/2021 – 08/31/2023

 

The research objective of the project is the integration of optical fibers in cavities on 3D surfaces using the mosquito method. In addition, industrial production should be made possible.

Project KAFE-3D

Combination of additive manufacturing with printed electronics for personalized products

 

Duration: 09/01/2021 – 08/31/2023

 

The aim of the research project is to manufacture new types of mechatronic systems by combining MID technology with the possibilities of additive manufacturing.

Project ZUFEK

Development of a reliable spring-based connection technology for digitally manufactured lead structures

 

Duration: 09/01/2021 – 08/31/2023

 

The project aims to develop an industrially suitable, spring-based contact element as well as user-friendly design guidelines for it. The final result is a calculation tool that allows companies to design contact elements for printed conductive structures based on defined requirements.

Project PrInterface

Technologies for high quality contacting of printed structures for level-3 interconnections between electronic assemblies

 

Duration: 03/01/2021 – 02/28/2023

 

The focus of the proposed project is on the evaluation of the manufacturability of functional and reliable Level 3 interconnections, for which printed circuit boards have to be contacted using conventional electronics production techniques.

2021 © Research Association Mechatronic Integrated Devices 3-D MID e.V.

|

Imprint

|

Data privacy