Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Applied Projects

Below you will find a summary of the projects currently being applied for. By clicking on the project name you will receive further information on the particular project.

The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.


Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office (see contact details). E-Mail to office


Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates


Duration: 06/01/2023 – 05/31/2025


The research objective is the qualification and establishment of an efficient and flexible process for the direct generation of three-dimensional ceramic circuit carriers for power electronic applications. To achieve this goal, laser powder cladding is used for selective copper deposition on 3D ceramics.

Project CEEE-ALU

CORNET – Circular Electrical and Electronic Equipment – The Aluminium Option [CEEE-ALU]


Duration: 09/01/2022 – 08/31/2024


The aim of the research project is to validate the suitability of aluminium as a functional housing material for small network devices. In this context, different methods and technologies, which are necessary for the success of the concept, are also examined for their feasibility.

Project MST-MID

Integrated Microsystems on functionalized MID polymer wafers (MST-MID)


Duration: 01/01/2024 – 12/31/2025


As a research objective, a simplified process for the manufacture of eddy current sensors is to be investigated with regard to process complexity and number of process steps. The question whether eddy current sensors can be manufactured without the use of lithography and complex packaging processes is to be answered. For this purpose, the LDS process in combination with plastic injection moulding is to provide the necessary technological foundation.

Project SolEnc

Digital printing of solution-based encapsulation of organic electronics on 3D surfaces


Duration: 10/01/2021 – 09/30/2023


The aim of this research work is to encapsulate printed organic electronics using digital printing processes.

Project KAFE-3D

Combination of additive manufacturing with printed electronics for personalized products


Duration: 09/01/2021 – 08/31/2023


The aim of the research project is to manufacture new types of mechatronic systems by combining MID technology with the possibilities of additive manufacturing.

Project ZUFEK

Development of a reliable spring-based connection technology for digitally manufactured lead structures


Duration: 09/01/2021 – 08/31/2023


The project aims to develop an industrially suitable, spring-based contact element as well as user-friendly design guidelines for it. The final result is a calculation tool that allows companies to design contact elements for printed conductive structures based on defined requirements.

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