Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Applied Projects

Below you will find a summary of the projects currently being applied for. By clicking on the project name you will receive further information on the particular project.

The documents of the projects are exclusively available to our members.
If you are not yet a member, you will find information on membership here.

 

Please note
The documents of the projects are unfortunately not available in English because all research is carried out in German.

If you have any further question related to a project, we kindly ask you to get in contact with one of the researchers directly. The contact information can be found on the project site or you can contact the office. E-Mail to office

Project LaMP

Laser activation of printed metal-polymer composites

 

Duration: 01/01/2021 – 12/31/2022

 

Research Objective: Creation of a continuous metallic structure on the surface of printed metal-polymer composites, thus increasing the electrical conductivity of the printed composite structure.

Project SolEnc

Digital printing of solution-based encapsulation of organic electronics on 3D surfaces

 

Duration: 10/01/2021 – 09/30/2023

 

The aim of this research work is to encapsulate printed organic electronics using digital printing processes.

Project CEEE-ALU

CORNET – Circular Electrical and Electronic Equipment – The Aluminium Option [CEEE-ALU]

 

Duration: 09/01/2022 – 08/31/2024

 

The aim of the research project is to validate the suitability of aluminium as a functional housing material for small network devices. In this context, different methods and technologies, which are necessary for the success of the concept, are also examined for their feasibility.

Project AMDEA

Additive manufacturing of dielectric elastomers for industrial use [AMDEA]

 

Duration: 01/01/2022 – 12/31/2023

 

The aim of the research project is to develop industrially scalable, additive manufacturing processes for dielectric elastomers and to create corresponding parameter guidelines.

Project AddiHF

Additive manufacturing of antennas by processing of high frequency plastics (AddiHF)

 

Duration: 11/01/2021 – 10/31/2023

 

The aim of the project is to investigate suitable combinations of plastics and AF manufacturing processes of RF components.

Project MST-MID

Integrated Microsystems on functionalized MID polymer wafers (MST-MID)

 

Duration: 10/01/2021 – 09/30/2023

 

As a research objective, a simplified process for the manufacture of eddy current sensors is to be investigated with regard to process complexity and number of process steps. The question whether eddy current sensors can be manufactured without the use of lithography and complex packaging processes is to be answered. For this purpose, the LDS process in combination with plastic injection moulding is to provide the necessary technological foundation.

Project 3D-MosquitOPrint

3D optical conductors on functional surfaces using the Mosquito method

 

Duration: 09/01/2021 – 08/31/2023

 

The research objective of the project is the integration of optical fibers in cavities on 3D surfaces using the mosquito method. In addition, industrial production should be made possible.

Project KAFE-3D

Combination of additive manufacturing with printed electronics for personalized products

 

Duration: 09/01/2021 – 08/31/2023

 

The aim of the research project is to manufacture new types of mechatronic systems by combining MID technology with the possibilities of additive manufacturing.

Project ZUFEK

Development of a reliable spring-based connection technology for digitally manufactured lead structures

 

Duration: 09/01/2021 – 08/31/2023

 

The project aims to develop an industrially suitable, spring-based contact element as well as user-friendly design guidelines for it. The final result is a calculation tool that allows companies to design contact elements for printed conductive structures based on defined requirements.

Project PrInterface

Technologies for high quality contacting of printed structures for level-3 interconnections between electronic assemblies

 

Duration: 03/01/2021 – 02/28/2023

 

The focus of the proposed project is on the evaluation of the manufacturability of functional and reliable Level 3 interconnections, for which printed circuit boards have to be contacted using conventional electronics production techniques.

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