Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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+49 911 5302 9 9102
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Invitation to the 12th MID Day – Acoustic Interfaces & Power Electronics

The MID Days inform you about research projects of the Research Association 3-D MID e.V. and provide insights into projects of our industry partners. Participation in the event is free of charge and open to all interested persons. The MID Days take place every three months in the afternoon from 4 PM to 5:30 PM (CE(S)T) via Zoom. There are two presentations, each 20 minutes long, followed by a Q&A session of about 10 minutes. After the presentations, speakers and participants will have the opportunity to network in the Zoom meeting. The event will be held in English.

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Figure: 3-D MID Showcase; Source: Clemens Wegener – Bauhaus University Weimar

1st Presentation: Bauhaus Form and Function Lab – Research activities and 3-D MID Showcase

Mr. Wegener introduces the Bauhaus Form and Function Lab (BFFL) of the Bauhaus-Universität Weimar and gives an insight into the status of the 3-D MID Showcase. In addition to the laboratory’s equipment and research focus, the future direction and details of the showcase’s development status will be discussed. A research project in the field of acoustic interfaces will then be presented. Applications in the field of high-resolution digital musical interfaces are derived from the new research project.

2nd Presentation: An innovative “start-up” company: iCuTech GmbH

In his presentation, Christian Göbl introduces his company iCuTech GmbH. He founded it in March 2022 and financed it with private money. The company now has a technology laboratory on the AEG site in Nuremberg and has software for CAD and simulations. They produce power semiconductor modules that make optimized use of SIC transistors. iCuTech works both for industry and for customers in the automotive sector. To this end, they have developed and patented innovative technologies for lamination, assembly and an improved series laser welding process for standard TO housings (e.g. TO263). In his presentation, Christian Göbl explains these innovative manufacturing and joining technologies and shows how they improve power electronics. He also gives an outlook on the future of the start-up.

You can find more MID events in the event calendar

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