Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Smart wireless MID sensor systems for IoT applications (MERLIN)

3D-printed electronics for IoT applications

The networking of machines, devices and applications in the Internet of Things (IoT) places high demands on product development. There is a mismatch between the high demand for individual sensors and the electronics technologies available on the market. The solution is sensors that are individually manufactured using additive manufacturing AM (3D printing). Thanks to these Mechatronic Integrated Devices (MID) produced in this way, mechanical and electrical functions are integrated into one component. Where it was previously difficult to place sensors, it is possible with the help of the new technology.

Within the scope of the ‘MERLIN’ project, the new possibilities for AM-MID applications in mechanical and plant engineering are to be analyzed and characterized. The focus is on the CMID process (powder coating-based), which allows any metallic base body, and the stereolithography process, which allows additively produced base bodies and for which a special MID photopolymer has been developed. An extended system is being developed which integrates design information, manufacturing-specific restrictions and functional solution aspects. Secondly, the contents of the systematics are to be validated based on the design and implementation of demonstrators. In this way, a secure, detailed understanding of the process will be built up and, at the same time, a system will be developed that will enable other companies to access the technology.


Project: Smart wireless MID sensor systems for IOT applications (MERLIN)

Project duration: 03/01/2021 until 02/28/2023

Project volume: 1.39 million euros


Mr. Dr.-Ing. Christoph Jürgenhake

Fraunhofer IEM

Phone: +49 (0) 5251 5465-118



F. Hemmelgarn, P. Ehlert, T. Mager, C. Jürgenhake, R. Dumitrescu and A. Springer: Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications. In: 2021 14th International Congress Molded Interconnect Devices (MID), 2021, pp. 1-8, doi: 10.1109/MID50463.2021.9361628.

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