Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
+49 911 5302 9 9100
+49 911 5302 9 9102
Computer Man Member area

LOPEC

3-D MID at LOPEC – trade fair for printed electronics

6th to 7th March 2024, booth FOE 05, ICM – International Congress Center Munich, Germany

The Research Association’s public relations work will once again kick off in 2024 with its participation in the international trade fair for printed electronics – LOPEC – in Munich. From March 6 to 7, 2024, the Research Association will present itself to the numerous trade fair and congress visitors and provide information about the diverse application possibilities of spatial electronic assemblies, its members and their offers as well as current research projects in the field of printed electronics.

Visit us at our stand FOE 05 – we look forward to seeing you!

 

The research association offers free visitor tickets for LOPEC 2024. These are available on request from the 3-D MID e.V. office. Please contact us by phone or e-mail (see contact details).

Further information about LOPEC can be found here.

3-D MID booth at LOPEC 2023

Further reports about LOPEC

 Successful Exhibition Booth at LOPEC 2023

With more exhibitors than ever before, LOPEC 2023 came to an end: 168 exhibitors from 25 countries and over 2,300 visitors from 43 countries came to the ICM at Messe München from 28th February to 2nd March. At the booth of the Research Association 3-D MID, demonstrators from current research projects and innovations from members, in particular Ensinger, were on display, arousing keen interest among visitors. Robert Süß-Wolf and Prof. Jörg Franke from the Research Association explained the tasks and organization of the Research Association for Mechatronic Integrated Devices and pointed out the advantages for companies that can be used with a membership. Markus Ankenbrand and Felix Häußler presented their research projects using posters.

A striking feature among the visitors was the large number of international contacts with company representatives from the printed electronics sector and with staff from international research institutions.

 

The focus in the field of printed electronics is on development, materials, process chains, quality assurance, business models and sustainability. Here, a large number of overlaps with the topics of mechatronic integration can be seen, as substrates such as films are often functionalized in two-dimensional space and then shaped to suit the application. The additive manufacturing of assemblies in multimedia printing systems is trend-setting. Here, diverse materials can be processed in adequate print heads to generate assemblies in one machine.

 

Participation in LOPEC was a complete success for the Research Association in terms of its goals, namely the promotion of technology for the manufacture of mechatronic devices, international networking and joint industrial research.

MID Session at LOPEC chaired by Prof. Dr. Franke

Dear Colleague,

 

At the upcoming LOPEC Conference from March 23–25, 2021 in Munich, I will chair the session MID of the Technical Conference. I would be very pleased if you would apply for a presentation slot or for exhibiting a poster.

 

Together with the accompanying exhibition, the LOPEC Conference is one of the most important annual platforms worldwide in the field of printed electronics. At last more than 200 contributions from 25 countries could be experienced.

The Conference structure—Business, Technical and Scientific Conference—ensures that you speak to the right audience, whether it is current business models, innovative developments or research results. For further information please click here.

 

Starting on September 3, 2020, you can submit your abstract (in English please, max. 3,000 characters incl. spaces) directly to LOPEC online here; the submission deadline is October 16, 2020. An international panel of experts will then review and decide which topics will be selected and put together the presentation program.

 

If you are accepted for an oral presentation or a poster, you will be eligible for a discounted conference ticket (Academic Ticket). Please note that a valid conference ticket is required in order to participate as a speaker or to present a poster.

 

If you do not plan to participate as a speaker, attending the Conference is certainly also worthwhile. To receive information about ticket availability early on, please register for the LOPEC newsletter here.

 

Whether on stage or in the audience: I would be delighted to welcome you at the upcoming LOPEC Conference!

 

Best regards,

Prof. Dr. Franke

Chairman 3-D MID

Successful participation of 3-D MID at LOPEC

Also this year the Research Association 3-D MID successfully took part in the LOPEC from 20th – 21st March 2019 in Munich. The leading trade fair for printed electronics offered a broad platform for exchange and networking. Through the exhibition of selected exhibits, as well as posters and a monitor presentation, the Research Association presented itself and its members. The 3D-MID technology caught the interest of many visitors and attracted interesting as well as purposeful technical discussions. Companies and research institutes showed great interest in the Research Association and its members, as well as further research into the possibilities of MID technology through research projects.

The increasing number of visitors to the trade fair, which even with its 2,700 participants, has set a new visitors record, according to the final report, shows that printed electronics is still on the technological advance. Through the various exhibits, the Research Association successfully presented their understanding of MID as Mechatronic Integrated Devices and thus addressed a broad mass of visitors from different technological fields. Motivated by the positive feedback, the Research Association sees the field of MID technology continue to expand and looks confidently into the future.

3-D MID presents their technologies to the visitors; Source: 3-D MID
 
2022 © Research Association Mechatronic Integrated Devices 3-D MID e.V.

|

Imprint

|

Data privacy