Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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MID Congress

The International MID Congress is a scientific congress organized and carried out by the Research Association 3-D MID, which deals with current topics concerning MID technologies. The event with scientific publications takes place every two years in different cities. Approximately 200 people from industry and science take part in this event.

Picture: The MID Congress attracts visitors from all over the world; Source: 3-D MID

MID Days

In March 2021, the new event series ‘MID Days’ took place for the first time. At the MID Days you will be informed about the research projects of the Research Association 3-D MID and get the opportunity to network with other participants. The event takes place once a quarter and is freely accessible and free of charge for all those interested in MID.

Picture: 3-D MID presents its research about MID technology to numerous visitors; Source: 3-D MID

MID Summit

The MID Summit was first held in 2019 and is scheduled for every two years. It serves to network the members of 3-D MID as well as external interested parties and offers insights into current trends in MID technologies. The members are given the opportunity to present themselves individually through exhibition booths, tabletop presentations and lectures. The summit, designed as an open exhibition, will be accompanied by technical lectures and guided tours of local research laboratories.

Picture: Visitors of the MID Summit 2019 listen to the interesting technical lectures; Source: 3-D MID

LOPEC – the trade fair for printed electronics

Since 2017, 3-D MID has had its own booth at the LOPEC trade fair every year. It informs visitors about the diverse application possibilities of spatial electronic assemblies, about its members and their offers, as well as about current research projects in the field of printed electronics. With more than 2,700 visitors from over 160 countries, LOPEC offers excellent opportunities to make new business contacts.

Picture: 3-D MID presents its research about MID technology to numerous visitors; Source: 3-D MID

Rapid.Tech 3D

At the Rapid.Tech 3D international trade congress, leading scientists and experts from the field will present the latest findings in industrial 3D printing. In the exhibition area, companies and research institutes will present the latest products and technologies in the trade exhibition.

Picture: The booth of the Research Association 3-D MID at Rapid.Tech 3D 2017; Source: 3-D MID

electronica – world‘s leading trade fair and conference for electronics

At the internationally renowned trade fair electronica in Munich, the Research Association 3-D MID will be presenting itself together with members on a joint booth measuring approx. 120 m². The openly designed booth concept with six screens enables the presentation of the entire process chain for the production of mechatronic integrated devices. The presentation is accompanied by showcases with numerous technical exhibits. In addition, the physical well-being and meeting possibilities are provided in order to be able to deepen the emerging contacts directly on site.

Picture: The image and video sequences for the production of molded interconnect devices attracted numerous interested parties to the MID joint booth; Source: 3-D MID

productronica – World’s Leading Trade Fair for Electronics Development and Production

Being the world’s leading trade fair for electronics development and production, productronica has many new things to offered to its exhibitors and visitors: World premieres and products, solutions and innovations spanning the entire value chain. Exclusive career opportunities with exciting networking formats. And, as usual, a top-class supporting program with specialist trend topics. At productronica, the decision-makers and thought leaders of the industry come together—from established key player organizations as well as innovative start-ups.

Picture: The process chain for the production of mechatronic integrated modules is shown by a series of technologically clustered monitors via image and video sequences.; Source: 3-D MID
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