Plasma Coating

Plasma spraying offers the possibility of coating a variety of material combinations due to the underlying process sequence. With a suitable handling station, the coating of three-dimensional basic substrates is possible.

The three-dimensional structure of functional layers is the subject of various research projects such as AgOn3D and CIMAMET.

Plasma-based coating technologies can be used to apply flexible die-top systems for power semiconductors.

Plasma-based plating technology enables cost-efficient and flexible copper metallisation, increasing the reliability and lifetime of power electronic modules
Inert atmosphere reduction allows plating under normal atmosphere, simplifying process handling and reducing equipment costs
The annealing process increases the adhesion between the metallisation and the substrate and also improves the coating quality.
The wafers are subsequently separated; the module structure with Cu-bond as the top-side connection is realised in subsequent processes.

Process flow

Substrate preparation
Metallisation
a, Generation of the plasma
b, Injection of the copper powder
c, Gas-particle reaction
d, Impingement on the substrate and layer formation
Assembly and bonding technology