Plasma spraying offers the possibility of coating a variety of material combinations due to the underlying process sequence. With a suitable handling station, the coating of three-dimensional basic substrates is possible.
Plasma-based coating technologies can be used to apply flexible die-top systems for power semiconductors.
- Plasma-based plating technology enables cost-efficient and flexible copper metallisation, increasing the reliability and lifetime of power electronic modules
- Inert atmosphere reduction allows plating under normal atmosphere, simplifying process handling and reducing equipment costs
- The annealing process increases the adhesion between the metallisation and the substrate and also improves the coating quality.
- The wafers are subsequently separated; the module structure with Cu-bond as the top-side connection is realised in subsequent processes.
- Substrate preparation
a, Generation of the plasma
b, Injection of the copper powder
c, Gas-particle reaction
d, Impingement on the substrate and layer formation
- Assembly and bonding technology
Advantages of Additive Plasma Coating
- Low thermal load on the substrate
- Wide range of substrates can be used (polymers, metals, ceramics)
- Short process times, as no pre- and post-treatment is necessary
- Environmentally friendly – chemical and solvent free
- Coating of 3D surfaces