Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Project Ideas

The project ideas listed below are currently in the application process. Click on the project name to get more information about the particular project.


We would be pleased to include further participants in the project-accompanying committee. If you are interested, please contact the office by phone or via e-mail (see contact details). E-Mail to office

Project Outline PreciEye

Specifying Non-Contact Intraocular Pressure Measurement for Self-Diagnosis


The aim of the research project is to specify and validate the contactless measurement method of the self-tonometer.

Project Outline 3D-OKMID

3D alignment and optical coupling of diodes to substrate-based optical fibers using mechatronic integrated device submounts


The research objective of this project is the implementation of a passively mountable optical interface for data communication in printed circuit boards.

Project Outline EdDing

Generation of Spatial Circuit Carriers Using Laser-Induced Direct Metallization of Industrially Established Ceramics


The aim of the research project is to establish an industrial 3D-capable process for the pretreatment, structuring and metallization of technically relevant, commercial ceramics (e.g. aluminum oxide, aluminum nitride, zirconium oxide) and to validate the reliability of products manufactured in this way

Project Outline Pre-Designer

Development planner for the design and production of hybrid circuit carriers


The aim of the research project is therefore to develop a development planner that combines classic 2D electronics and MID technology and provides the product developer with comprehensive and hybrid solution concepts.

Project Outline MULTISENS

Passive Wireless Readout Sensors Based on Additively Manufactured Multi-Material Resonant Circuits


The aim of the research project is to develop passive temperature and strain sensors with high sensitivity and transmission quality using printed multi-material resonant circuits.

Project Outline EnDE-Flex

Flexible energy harvesting patch for application directly to the human body


The aim of the project is to qualify and optimize flexible, DE-based patches for energy harvesting directly on the human body from kinetic energy.

Project Outline 3D-Optronic MID

3D-Opto-electronic MID by thermoforming of additively manufactured hybrid systems


The aim of the project is to produce 3D components with fully integrated electrical conductors and optical networks.

Project Outline Adhesion4PE

Measurement of the adhesive strength of printed conductive layers in electronics production


The aim is to subject existing methods for measuring adhesive strength to a thorough investigation of the weak points, influencing variables and possible correlations between results.

Project Outline E|AlOxid

Power density electromagnetic actuators by winding body of Al2O3-insulated aluminum foils


As part of the project, the technical feasibility of the approach and the benefits of the targeted technology are to be examined in more detail. The aim is to use the theoretical advantages such as to prove better thermal connection and higher volumetric power density by setting up demonstrators.

Project Outline HAKa3D

High-performance deposition of copper layers on three-dimensional circuit carriers


The aim of the research project is to develop a profound understanding of the processes involved in the creation, characterization and evaluation of galvanically reinforced circuit diagrams on three-dimensional thermoplastic components.

Project Outline 3D-MID Aero Printing

IGF – Fast and flexible manufacturing of highly integrated 3D-MID prototypes using laser assisted aerosol jet and FDM printing [3D-MID Aero Printing]


The research objective is the development of a process chain for the production of highly integrated 3D-MID components using laser-based aerosol jet and 3D printing (FDM).

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