Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Project Ideas

The project ideas listed below are currently in the application process. Click on the project name to get more information about the particular project.

 

We would be pleased to include further participants in the project-accompanying committee. If you are interested, please contact the office by phone (+49 911 5302-9100) or via e-mail. E-Mail to office

Project Outline SolEnc

Digital printing of solution-based encapsulation of organic electronics on 3D surfaces

 

The aim of this research work is to encapsulate printed organic electronics using digital printing processes.

Project Outline Adhesion4PE

Measurement of the adhesive strength of printed conductive layers in electronics production

 

The aim is to subject existing methods for measuring adhesive strength to a thorough investigation of the weak points, influencing variables and possible correlations between results.

Project Outline INSILE

Inductive inline sintering for printed conductor tracks with a process control

 

Research objective: Inductive inline sintering of printed, wet conductor tracks in combination with a process control

Project Outline FHVEB

Flexible interconnections on three-dimensional components

 

Research objective: Examination of the innovative wire laying technology with regard to the nature of the wire material, the fixation in the substrate, the optimal process parameters and the characteristics of the applied interconnections before industrial use.

Project Outline E|AlOxid

Power density electromagnetic actuators by winding body of Al2O3-insulated aluminum foils

 

As part of the project, the technical feasibility of the approach and the benefits of the targeted technology are to be examined in more detail. The aim is to use the theoretical advantages such as to prove better thermal connection and higher volumetric power density by setting up demonstrators.

Project Outline HAKa3D

High-performance deposition of copper layers on three-dimensional circuit carriers

 

The aim of the research project is to develop a profound understanding of the processes involved in the creation, characterization and evaluation of galvanically reinforced circuit diagrams on three-dimensional thermoplastic components.

Project Outline AMDEA

Additive manufacturing of dielectric elastomers for industrial use

 

The aim of the project is to additively manufacture functional mechatronic converters in a manufacturing process that are designed for industrial use in order to show their technological superiority over conventional approaches.

Project Outline KAFE-3D

Combination of additive manufacturing with printed electronics for personalized products

 

The aim of the research project is the production and characterization of novel mechatronic systems by combining additive manufacturing with printed electronics.

Project Outline 3D-MosquitOPrint

3D optical conductors on functional surfaces using the Mosquito method (3D-MosquitOPrint)

 

The aim of the project is the generation of fully integrated optical waveguides on three dimensional components, which are to be made accessible for the connection of commercial sources and sinks via a novel surface contacting method.

Project Outline ZUFEK

Development of a reliable spring-based connection technology for digitally manufactured lead structures (ZUFEK)

 

Research Objective: Development of a reliable, puncture-resistant, electrical contact based on spring elements

Project Outline LaMP

Laser activation of printed metal-polymer composites (LaMP)

 

Research Objective: Creation of a continuous metallic structure on the surface of printed metal-polymer composites, thus increasing the electrical conductivity of the printed composite structure.

Project Outline 3D-MID Aero Printing

IGF – Fast and flexible manufacturing of highly integrated 3D-MID prototypes using laser assisted aerosol jet and FDM printing [3D-MID Aero Printing]

 

The research objective is the development of a process chain for the production of highly integrated 3D-MID components using laser-based aerosol jet and 3D printing (FDM).

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