The project ideas listed below are currently in the application process. Click on the project name to get more information about the particular project.
We would be pleased to include further participants in the project-accompanying committee. If you are interested, please contact the office by phone (+49 911 5302-9100) or via e-mail (firstname.lastname@example.org). E-Mail to office
Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates
The research objective is the qualification and establishment of an efficient and flexible process for the direct generation of three-dimensional ceramic circuit carriers for power electronic applications. To achieve this goal, laser powder cladding is used for selective copper deposition on 3D ceramics.
Development planner for the design and production of hybrid circuit carriers
The aim of the research project is therefore to develop a development planner that combines classic 2D electronics and MID technology and provides the product developer with comprehensive and hybrid solution concepts.
Passive Wireless Readout Sensors Based on Additively Manufactured Multi-Material Resonant Circuits
The aim of the research project is to develop passive temperature and strain sensors with high sensitivity and transmission quality using printed multi-material resonant circuits.
Flexible energy harvesting patch for application directly to the human body
The aim of the project is to qualify and optimize flexible, DE-based patches for energy harvesting directly on the human body from kinetic energy.
3D-Opto-electronic MID by thermoforming of additively manufactured hybrid systems
The aim of the project is to produce 3D components with fully integrated electrical conductors and optical networks.
Measurement of the adhesive strength of printed conductive layers in electronics production
The aim is to subject existing methods for measuring adhesive strength to a thorough investigation of the weak points, influencing variables and possible correlations between results.
Flexible interconnections on three-dimensional components
Research objective: Examination of the innovative wire laying technology with regard to the nature of the wire material, the fixation in the substrate, the optimal process parameters and the characteristics of the applied interconnections before industrial use.
Power density electromagnetic actuators by winding body of Al2O3-insulated aluminum foils
As part of the project, the technical feasibility of the approach and the benefits of the targeted technology are to be examined in more detail. The aim is to use the theoretical advantages such as to prove better thermal connection and higher volumetric power density by setting up demonstrators.
High-performance deposition of copper layers on three-dimensional circuit carriers
The aim of the research project is to develop a profound understanding of the processes involved in the creation, characterization and evaluation of galvanically reinforced circuit diagrams on three-dimensional thermoplastic components.
IGF – Fast and flexible manufacturing of highly integrated 3D-MID prototypes using laser assisted aerosol jet and FDM printing [3D-MID Aero Printing]
The research objective is the development of a process chain for the production of highly integrated 3D-MID components using laser-based aerosol jet and 3D printing (FDM).