Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Review of the 2nd MID Day

The 2nd MID Day on 12th May 2021 was very well received by those interested in MID. More than 45 participants attended the new series of events.

 

The event is open to all MID interested parties and free of charge. At the MID Days, participants gain insights into the research projects of the Research Association 3-D MID. Furthermore, the members of the Research Association present MID technologies from industry that are attracting particularly great interest.

 

At the 2nd MID Day, the managing director of 3-D MID Philipp Bräuer introduced the Research Association and its current research topics.

 

Florian Roick from LPKF Laser & Electronics AG then provided very clear and comprehensible information about the challenges of IC packaging. The AMP technology presented offers a completely new approach using thermoset masses and laser structuring as well as subsequent metallisation. This significantly increases the functional integration density and eliminates the bonding process.

 

Mohd-Khairulamzari Hamjah from the Chair of FAPS at FAU Erlangen-Nuremberg presented the completed research project “OLE-3D”. In this project, the digital printing of organic optoelectronics on 3D bodies was investigated. Among other things, he presented the requirements for the material, the integration of the printing system and the research results to the participants.

 

After the presentations, both speakers answered the participants’ remaining questions.

Finally, the speakers and participants were able to network in small groups on the platform wonder.me.

 

The next MID Day will take place on 11th August 2021. More information will be available here soon.

Further MID Day dates and other events can be found in the events calendar.

 

 

Source [1]: M. -K. Hamjah, M. Steinberger, K. C. Tam, H. -J. Egelhaaf, C. J. Brabec and J. Franke, „Aerosol jet printed AgNW electrode and PEDOT:PSS layers for organic light-emitting diode devices fabrication,“ 2021 14th International Congress Molded Interconnect Devices (MID), 2021, pp. 1-4, doi: 10.1109/MID50463.2021.9361616.
Figure 1: 3D Laser Direct Structuring LDS; Source: LPKF Laser & Electronics AG
Figure 2: AMP Sample; Source: LPKF Laser & Electronics AG
Figure 3: Blade coating OLED samples as reference; Source: [1]
Figure 4: Hybrid fabrication OLED samples; Source: [1]
2021 © Research Association Mechatronic Integrated Devices 3-D MID e.V.

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