Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Review of the 4th MID Day

50 people attended the 4th MID Day on 10th November 2021 and contributed to lively discussions.

Brayden Technical Agency LLC, based in North America, was represented by the company’s director, William Slade. He gave the first presentation “3D MID and hardware innovation from North America”. He outlined the most important sectors for MID applications in the USA over the last five years up to the present day. He also discussed the possibilities of MID prototyping, the possibility of recycling thermoplastic LDS MID materials and the biocompatibility of LDS MID.

 

Afterwards, Ejvind Olsen from Leibniz University Hannover – ITA presented the results of the project “3D CopperPrint” – generative generation of copper conductors by laser sintering on adaptive spatial circuit carriers. The project was coordinated by 3-D MID and completed at the end of 2020. The aim of the research project was to develop a cost-effective and resource-saving process for the deposition of copper conductors. Following his presentation, he continued to discuss with the participants the contacting possibilities through soldering and the multilayer structure.

 

Our members can find the presentations of all past MID Days here.

 

The next MID Day will take place on 9th February 2022.

More information about the next MID Day will be available here soon.

You can find more MID Day dates and other events in the events calendar.

Figure: ABS antenna cover; Source: Olsen , E.; Overmeyer, L (2021): „Printing of laser generated conductive copper tracks on 3D components“, 14 th MID Congress 2021, IEEE, doi.org/10.1109/MID50463.2021.9361618
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