Technologies for high quality contacting of printed structures for level-3 interconnections between electronic assemblies
Duration: 11/29/2021 – 08/01/2022
The focus of the project is on the evaluation of the manufacturability of functional and reliable Level 3 interconnections, for which printed circuit boards have to be contacted using conventional electronics production techniques.
For this purpose, the contacting techniques ACF heat sealing, stirrup soldering, crimping and press-fitting in combination with rigid and flexible substrates will be investigated. The conductor structures are built up with silver-containing inks and pastes using different printing techniques that represent the relevant spectrum of printed layer thicknesses.
This results in the following central scientific and technical tasks for the research proposal:
- Research and characterisation of the Level 3 contacting techniques ACF heat sealing, stirrup soldering, crimping and press-fitting for printed circuits based on relevant standards from established electronics production.
- Qualification of the contacting techniques for the applications from the automotive and wearable sectors to be defined with the project-accompanying committee (PA) as well as analysis of the service life under realistic load collectives.
- Presentation of the deficits identified and analysis of the cause-effect relationships for the level 3 connections to be investigated.
Research institutes and contact persons
For further contact details, please contact the office. E-Mail to office
University of Technology Nuremberg Georg Simon Ohm
Institute for Chemistry, Materials and Product Development (OHM-CMP)
Head of the Research Department: Prof. Dr. Marcus Reichenberger
90489 Nuremberg, GER
Institute for Factory Automation and Production Systems (FAPS)
Head of the Research Department: Prof. Dr. Joerg Franke
91058 Erlangen, GER