Description
Additive manufacturing of power electronic circuit carriers
Duration: 05/01/2018 – 04/30/2021
Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.
Research institutes and contact persons
For further contact details, please contact the office. E-Mail to office
Friedrich-Alexander University Erlangen-Nuremberg
WW3 (Glass and ceramics)
Prof. Dr. Nahum Travitzky
Martensstr. 5
91058 Erlangen, GER
Friedrich-Alexander University Erlangen-Nuremberg
Institute for Factory Automation and Production Systems (FAPS)
Thomas Stoll
Fuerther Straße 246b
90429 Nuremberg, GER
Documents
Documentation on the project is available in the members’ area or on request from the office at info@3dmid.de. E-Mail to office
If you are not a member yet, you will find information about membership here.
1) Project Meeting Minutes 10/15/2018
1) Project Meeting Presentation 10/15/2018
Summary of the final publication (freely accessible to all)
