Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
+49 911 5302 9 9100
+49 911 5302 9 9102
Computer Man Member area

IGF Project 20144 N – Ampec


Additive manufacturing of power electronic circuit carriers


Duration: 05/01/2018 – 04/30/2021


Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.

Research institutes and contact persons

For further contact details, please contact the office. E-Mail to office


Friedrich-Alexander University Erlangen-Nuremberg

WW3 (Glass and ceramics)

Prof. Dr. Nahum Travitzky

Martensstr. 5
91058 Erlangen, GER


Friedrich-Alexander University Erlangen-Nuremberg

Institute for Factory Automation and Production Systems (FAPS)

Thomas Stoll

Fuerther Straße 246b
90429 Nuremberg, GER


Documentation on the project is available in the members’ area or on request from the office at E-Mail to office

If you are not a member yet, you will find information about membership here.


Project Application

1) Project Meeting Minutes 10/15/2018

1) Project Meeting Presentation 10/15/2018

Progress Report 2018

Progress Report 2020

Final Report

Summary of the final publication (freely accessible to all)

2022 © Research Association Mechatronic Integrated Devices 3-D MID e.V.




Data privacy