Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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IGF Project 20144 N – Ampec

Description

Additive manufacturing of power electronic circuit carriers

 

Duration: 05/01/2018 – 04/30/2021

 

Objective: To provide an improved process for the additive fabrication of Cu-based metal layers as well as of ceramic circuit carriers by laser melting or laser sintering.

Research institutes and contact persons

For further contact details, please contact the office. E-Mail to office

 

Friedrich-Alexander University Erlangen-Nuremberg

WW3 (Glass and ceramics)

Prof. Dr. Nahum Travitzky

Martensstr. 5
91058 Erlangen, GER

 

Friedrich-Alexander University Erlangen-Nuremberg

Institute for Factory Automation and Production Systems (FAPS)

Thomas Stoll

Fuerther Straße 246b
90429 Nuremberg, GER

www.faps.fau.eu

Documents

Documentation on the project is available in the members’ area or on request from the office at info@3dmid.de. E-Mail to office

If you are not a member yet, you will find information about membership here.

 

Project Application

1) Project Meeting Minutes 10/15/2018

1) Project Meeting Presentation 10/15/2018

Progress Report 2018

Progress Report 2020

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