3-D MID at electronica – world‘s leading trade fair and conference for electronics
12th – 15th November 2024, Messe Munich
At the internationally renowned trade fair electronica in Munich, the Research Association 3-D MID will be presenting itself together with members on a joint booth measuring approx. 100 m². The openly designed booth concept with six screens enables the presentation of the entire process chain for the production of mechatronic integrated devices. The presentation is accompanied by showcases with numerous applications, displays and demonstrators. In addition, the physical well-being and meeting possibilities are provided in order to be able to deepen the emerging contacts directly on site.
At the world’s leading trade fair electronica 2022, 2,144 exhibitors, 64 percent of them from abroad, presented their innovations for the entire spectrum of electronics to around 70,000 visitors.
Joint Booth 2024
After the successful appearance at electronica in November 2022, the Research Association is planning to participate again with a joint booth in 2024. In order to be able to represent the competences across the entire manufacturing process, we again cordially invite all our members to participate as co-exhibitors at the joint booth.
For more information, please contact the office. Email to office
Image 2: Joint booth at electronica 2022
Participants of the Joint Booth 2022
Further reports about electronica
13th to 16th November 2018, Messe München – Hall A1, booth 443
In addition to the MID Congress, the participation with a joint booth at the electronica 2018, the world’s leading trade fair for components, systems and applications of electronics in Munich, represents another highlight of this year’s activities of the Research Association 3-D MID e.V.
The joint booth was a huge success. Due to the broad technical line-up of the ten co-exhibitors, a suitable contact person could be found at the booth for every technical question. Visitors’ interest in the Research Association and technology clearly showed that MID technology is still of great importance to the industrial market. Over 200 contact details were recorded. In addition, promising projects and research projects were discussed.
Exhibiting companies and institutes
The following institutes and companies from all areas of interdisciplinary technology were represented at the joint booth:
- Research Association 3-D MID e.V.
- 2E mechatronic GmbH & Co. KG
- Ensinger Sintimid GmbH
- Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
- HARTING AG Biel
- LPKF Laser & Electronics AG
- MacDermid Enthone Electronics Solutions
- MEP Europe B.V.
- MID Solutions GmbH
- TEPROSA GmbH
- University Erlangen-Nürnberg, FAPS – Institute for Factory Automation and Production Systems (FAPS)
The joint booth
Due to the success at productronica 2017, the booth concept was also adopted for electronica 2018. In order to visualize the process chain for the production of molded interconnect devices to visitors, they are represented by means of image and video sequences and supported by the technologically appropriate exhibits of the co-exhibitors in the showcases below.
3-D MID flyer for the trade fair appearance