Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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electronica

3-D MID at electronica – world‘s leading trade fair and conference for electronics

15th – 18th November 2022, Messe Munich

At the internationally renowned trade fair electronica in Munich, the Research Association 3-D MID will be presenting itself together with members on a joint booth measuring approx. 100 m². The openly designed booth concept with six screens enables the presentation of the entire process chain for the production of mechatronic integrated devices. The presentation is accompanied by showcases with numerous technical exhibits. In addition, the physical well-being and meeting possibilities are provided in order to be able to deepen the emerging contacts directly on site.

 

electronica is the world‘s leading trade fair for components, systems and applications in electronics. In 2018, it attracted over 3,100 exhibitors from 53 countries and more than 81,000 visitors.

Source: electronica

Joint Booth 2022

After the successful appearance at electronica in November 2018, the Research Association is planning to participate again with a joint booth in 2022. In order to be able to represent the competences across the entire manufacturing process, we again cordially invite all our members to participate as co-exhibitors at the joint booth.

Please fill out the form below and return it to the office of the Research Association by 20th December 2021 at the latest.

Participation form for the joint booth

For more information, please contact the office by phone (+49 911 5302-9100) or via email (info@3d-mid.de). Email to office

Image 1: The booth offers the opportunity for meetings to deepen the resulting contacts directly on site; Source: 3-D MID
Image 2: Joint booth at electronica 2018; Source: 3-D MID

These companies had registered for the joint booth 2020:  

Name Logo
LPKF
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
2E Mechatronic GmbH & Co. KG
MacDermid
MEP
Ensinger Sintimid GmbH
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik der FAU (FAPS)
MID-Solutions
Teprosa
Beta LAYOUT GmbH
HARTING AG Biel

Further reports about electronica

13th to 16th November 2018, Messe München – Hall A1, booth 443

In addition to the MID Congress, the participation with a joint booth at the electronica 2018, the world’s leading trade fair for components, systems and applications of electronics in Munich, represents another highlight of this year’s activities of the Research Association 3-D MID e.V.

The joint booth was a huge success. Due to the broad technical line-up of the ten co-exhibitors, a suitable contact person could be found at the booth for every technical question. Visitors’ interest in the Research Association and technology clearly showed that MID technology is still of great importance to the industrial market. Over 200 contact details were recorded. In addition, promising projects and research projects were discussed.

Exhibiting companies and institutes

The following institutes and companies from all areas of interdisciplinary technology were represented at the joint booth:

 

  • Research Association 3-D MID e.V.
  • 2E mechatronic GmbH & Co. KG
  • Ensinger Sintimid GmbH
  • Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
  • HARTING AG Biel
  • LPKF Laser & Electronics AG
  • MacDermid Enthone Electronics Solutions
  • MEP Europe B.V.
  • MID Solutions GmbH
  • TEPROSA GmbH
  • University Erlangen-Nürnberg, FAPS – Institute for Factory Automation and Production Systems (FAPS)

The joint booth

Due to the success at productronica 2017, the booth concept was also adopted for electronica 2018. In order to visualize the process chain for the production of molded interconnect devices to visitors, they are represented by means of image and video sequences and supported by the technologically appropriate exhibits of the co-exhibitors in the showcases below.

3-D MID flyer for the trade fair appearance

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