13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more 10. June 2022 Smart wireless MID sensor systems for IoT applications (MERLIN) Read more 8. June 2022 Jürgenhake as a New Member of the Research Association Read more 30. May 2022 Promoting innovation more strongly through ZIM funding Read more 24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more 18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more 2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more 28. April 2022 Introduction of the Project Outline: Passive Wireless Readout Sensors Based on Additively Manufactured Multi-Material Resonant Circuits [MULTISENS] Read more 26. April 2022 Powerlyze GmbH – new member of the Research Association Read more 12. April 2022 Invitation to the 6th MID Day – Additive Manufacturing & Characterization Methods of Printed Electronics Read more 31. March 2022 3-D MID e.V. presented itself at LOPEC 2022 Read more 14. March 2022 Introduction of the project outline: Flexible energy harvesting patch for application directly to the human body [EnDE-Flex] Read more Prev 1 … 4 5 6 … 13 Next
13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more
24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more
18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more
2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more
28. April 2022 Introduction of the Project Outline: Passive Wireless Readout Sensors Based on Additively Manufactured Multi-Material Resonant Circuits [MULTISENS] Read more
12. April 2022 Invitation to the 6th MID Day – Additive Manufacturing & Characterization Methods of Printed Electronics Read more
14. March 2022 Introduction of the project outline: Flexible energy harvesting patch for application directly to the human body [EnDE-Flex] Read more
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