The Research Association 3-D MID presented itself with a booth at the LOPEC 2022 on the 23rd and 24th of March. The visitors were informed at the exhibition booth of 3-D MID about the various application possibilities of Mechatronic Integrated Devices, their members and their offers as well as current research projects in the field of 3D electronics.
The international trade fair for printed electronics at the ICM (International Congress Center Munich) attracted over 2,000 trade fair and congress visitors this year. 156 exhibitors from 23 countries came to this international trade fair and congress for flexible, organic and printed electronics. More than half of the participants were international visitors (LOPEC 2022).
Numerous key players took part in the fair as exhibitors, such as Coatema, DuPont Teijin Films, Eastman Kodak, ELANTAS, Operations, Hamamatsu Photonics, Henkel, Heraeus, Kroenert, NovaCentrix, Panasonic, Siemens or Varta Microbattery, among others. Most exhibitors came – besides Germany – from France, the USA, the Netherlands and Italy (LOPEC 2022).
There is a lot going on in the focus areas of mobility and smart living. Research and development in printed flexible electronics has made enormous progress in the last three years, explains Wolfgang Mildner, General Chair of LOPEC. Especially in the focus topics, new applications and products showed that printed electronics is enabling more and more products and businesses (LOPEC 2022).
At the LOPEC congress, the topic “3D Structural Electronics” was represented with its own session. There, the integration of electronics and other multi-physical functions into structural elements, e.g. by 3D printing, laser structuring, overmolding, thermoforming or 3D-MID techniques and the application in the fields of mobile electronics, automotive, aerospace, medical devices, sensors and interconnects, household appliances, wearables and clothing was covered.