24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more
18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more
2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more
28. April 2022 Introduction of the Project Outline: Passive Wireless Readout Sensors Based on Additively Manufactured Multi-Material Resonant Circuits [MULTISENS] Read more
12. April 2022 Invitation to the 6th MID Day – Additive Manufacturing & Characterization Methods of Printed Electronics Read more