24. June 2020 Project Outline: Development of a reliable spring-based connection technology for digitally manufactured lead structures (ZUFEK) Read more
24. June 2020 Project Outline: Digital printing of conductive inks using inkjet for miniaturization of electronic assemblies (DigiTIMe) Read more
3. May 2020 Project Outline: IGF – Investigation of the influence of thermally conductive fillers on flame retardant substrate materials [FLA-HEAT] Read more
12. March 2020 Project Outline: IGF – 3D multilayer printing from Mechatronic Integrated Devices [3D-MLD] Read more