The Research Association 3-D MID e.V. is still looking for companies to accompany the project.
If you are interested, please contact the office. E-Mail to office
Research objective
- Printing of multilayer 3D-MID with vias
Desired research results
- Analysis of layer parameters (thickness, number and stability)
- Investigation regarding geometric limitation by the 3D component surface
Innovative contribution of the targeted research results
- Production of multilayer circuits with short process chain
- Conserving resources by dispensing with chemical baths
- Transfer of the process to large components is possible, as no chemical baths are necessary
Solution to achieve the research objective
- Investigation of the wetting and adhesive strength of the individual layers
- Laser processing and ablation of insulation materials
- Laser sintering for the metallization of conductor paths and through holes
Expected use of the envisaged research results in SMEs
- More compact product design through direct routing of the conductor paths
- Short process chain compared to the production of conventional electronics
Expected contribution to increasing the competitiveness of SMEs
- Production of multilayer MIDs is a unique selling point on the market
- Substitution of PCB Technology by circuits directly on the component surface
Expected industrial implementation of the R&D results after the end of the project
- Fine-pitch contacting of area array microcontroller and sensor chips on 3D component
Research institution
- Leibniz University of Hannover (ITA)
