Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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+49 911 5302-9102
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Hahn-Schickard Workshop: „Visions to Products – MID and Beyond“, innovative Anwendungen von Molded Interconnect Devices

Bild: Hahn-Schickard Workshop: „Visions to Products – MID and Beyond“, innovative Anwendungen von Molded Interconnect Devices

This year, Hahn-Schickard is again the organizer of the workshop “Visions to Products – MID and Beyond” in Stuttgart with international speakers from industry and industry-related research.

With many megatrends (Industry 4.0, Internet of Things, Smart Home, telemedicine, etc.) there is an increased demand for highly integrated sensors to capture and process data. One approach to realize such sensors is offered by spatial electronics. The potential of spatial electronics lies in the very large freedom of design, 3D capability, the ability to integrate mechanical, electrical and optical functions, and miniaturization.

An essential focus of the workshop is on innovative applications of 3D-MID technology. The variety of possible applications will be clearly demonstrated by application-oriented lectures from various branches of industry. In addition, the workshop will highlight how technologies based on film substrates extend this spectrum and can be used sensibly in the context of spatial circuit carriers.

In the field of spatial electronics, Hahn-Schickard is working, among other things, on increasing the maturity of technologies used in series products through standardization and an improved understanding of reliability, on tapping the potential for miniaturization through further technological development, and on enabling use under harsh environmental conditions by expanding the range of materials from thermoplastics to ceramics and thermosets.

The focus of the workshop is on the dialogue between innovative applications from different industrial sectors and new technologies. The following speakers, among others, are expected:

  • J. Kostelnik, Würth Elektronik GmbH & Co. KG: “Flexible and Stretchable PCBs for Smart Electronics”,
  • S. I. Hansen, Sensocure as: “Biomedical Sensor Development Utilizing MID Technology
  • J. Reitterer, TriLite Technologies GmbH: “From Pixels to Trixels: Glasses-free 3D Billboards
  • S. Rosenberger, Merck KGaA: “Laser Pigments for Additive Manufacturing and Prototyping for 3D MIDs”.

Date: 10.10.2017

Time: 9.00h – 17.00h

Location: House of Economy, Stuttgart

Participation fee: 280,- € incl. tax
(workshop documents, lunch buffet and drinks during breaks)

You can find the workshop flyer with the detailed programme at

http://hahn-schickard.de/fileadmin/media/06_HahnSchickard/00_Aktuelles/News/2017-10-10_Flyer_Workshop_MID_and_Beyond_R2.pdf

Please register via the following website:

www.hahn-schickard.de/anmeldung-mid-workshop/

Contact

Fürther Strasse 246b
D-90429 Nürnberg
Phone: +49 911 5302-9100
Fax: +49 911 5302-9102
E-Mail: info@3dmid.de

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