27. October 2020 Project Outline: Nickel-free metallization systems on 3D MID substrate materials (NiMm3) Read more 15. October 2020 Project Outline: Fast and flexible production of 3D-MID prototypes using laser-assisted AerosolJet- and SLS-Printing (3D-MID Aero Printing) Read more 10. October 2020 SUNWAY Communication as new member Read more 8. September 2020 MID Session at LOPEC chaired by Prof. Dr. Franke Read more 27. August 2020 Cancellation of the joint booth of 3-D MID at electronica 2020 Read more 3. July 2020 Our new member: iFE – Institute for Energy Research of TH OWL Read more 25. June 2020 AiF-IGF-Project 19605 N “AVerdi” Final Report Read more 24. June 2020 Project Outline: Additive manufacturing of antennas by processing of high frequency plastics (AddiHF) Read more 24. June 2020 Project Outline: Integrated Microsystems on functionalized MID polymer wafers (MST-MID) Read more 24. June 2020 Project Outline: Development of a reliable spring-based connection technology for digitally manufactured lead structures (ZUFEK) Read more 24. June 2020 Project Outline: Digital printing of conductive inks using inkjet for miniaturization of electronic assemblies (DigiTIMe) Read more 18. June 2020 14th International Congress MID postponed Read more Prev 1 … 9 10 11 … 13 Next
27. October 2020 Project Outline: Nickel-free metallization systems on 3D MID substrate materials (NiMm3) Read more
15. October 2020 Project Outline: Fast and flexible production of 3D-MID prototypes using laser-assisted AerosolJet- and SLS-Printing (3D-MID Aero Printing) Read more
24. June 2020 Project Outline: Additive manufacturing of antennas by processing of high frequency plastics (AddiHF) Read more
24. June 2020 Project Outline: Integrated Microsystems on functionalized MID polymer wafers (MST-MID) Read more
24. June 2020 Project Outline: Development of a reliable spring-based connection technology for digitally manufactured lead structures (ZUFEK) Read more
24. June 2020 Project Outline: Digital printing of conductive inks using inkjet for miniaturization of electronic assemblies (DigiTIMe) Read more
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