Nickel-free metallization systems on 3D MID substrate materials (NiMm3)
Duration: 05/01/2021 – 10/31/2023
Research Objective
The planned NiMm3 project is intended to provide important insights for the design and manufacture of reliable 3D circuit carriers. In particular, the weak points of previous MIDs identified by industry representatives will be addressed. On the other hand, new applications for MIDs with nickel-free conductor paths are also to be developed. The focus here is primarily on use in high-frequency technology and medical technology, where the avoidance of nickel is desirable.
Research institutes and contact persons
For further contact details, please contact the office. E-Mail to office
Friedrich-Alexander University Erlangen-Nuremberg
Institute for Factory Automation and Production Systems (FAPS)
Head of the Research Unit: Prof. Dr.-Ing. Joerg Franke
Egerlandstraße 7-9
91058 Erlangen, GER
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
Institute for Microstructure Technology
Head of the Research Unit: Prof. Dr.-Ing. A. Zimmermann
Allmandring 9 b
70569 Stuttgart, GER
Documents
Documents about the project are available in the members area.
If you are not a member yet, you will find information about membership here.
1) Project Meeting Presentation
2) Project Meeting Minutes 12/15/2021
2) Project Meeting Presentation Introduction 12/15/2021