19. January 2023 Introduction of the project outline: 3D alignment and optical coupling of diodes to substrate-based optical fibers using mechatronic integrated device submounts [3D-OKMID] Read more
29. August 2022 Introduction of the project outline: Generation of Spatial Circuit Carriers Using Laser-Induced Direct Metallization of Industrially Established Ceramics [EdDing] Read more
1. July 2022 Introduction of the Research Project “Laser Direct Structured Circuits on Silicone” Read more
13. June 2022 Progress Report of the project “PrESens” – Additive Manufacturing for the Integration of Sensor Technology in Mechatronic Systems Read more
24. May 2022 Introduction of the project outline: Characterization of laser powder cladding for fast, flexible and direct generation of conductive structures on three-dimensional ceramic substrates [CeraClad] Read more
18. May 2022 Progress report of the project DigiTIMe [Digital printing of conductive inks by inkjet for miniaturization of electronic assemblies] Read more
2. May 2022 Introduction of the project outline: Development planner for the design and production of hybrid circuit carriers [Pre-Designer] Read more
28. April 2022 Introduction of the Project Outline: Passive Wireless Readout Sensors Based on Additively Manufactured Multi-Material Resonant Circuits [MULTISENS] Read more
14. March 2022 Introduction of the project outline: Flexible energy harvesting patch for application directly to the human body [EnDE-Flex] Read more
15. November 2021 New project outline: Spatially optimised production of a power module using stereolithographic multi-material manufacturing [MultiPower] Read more
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