Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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The Research Association at LOPEC 2022

The Research Association will also have a booth at LOPEC 2022 from 22nd to 24th March. At the exhibition booth of 3-D MID, visitors will be informed about the diverse application possibilities of spatial electronic assemblies, its members and their offers as well as current research projects in the field of printed electronics.

 

The international trade fair for printed electronics in Munich attracts numerous trade fair and congress visitors every year. In 2019, more than 2,700 participants from 44 countries visited LOPEC. Exhibitors from all areas of printed electronics technology meet users from a wide range of industries at this cross-sectional trade fair.

 

As every year, the LOPEC Congress will be held at the same time as the trade fair, with a separate session on “3D Structural Electronics”. This area will cover the integration of electronics and other multi-physical functions onto structural elements e.g. via 3D printing, laser structuring, in-molding, thermoforming, or 3D MID and its application in mobile electronics, automotive, aerospace, medical devices, sensors and connectors, household appliances, wearables and clothing.

 

 

Would you like to learn more about the Research Association and its members?

Then visit our exhibition booth at LOPEC 2022.

 

Members of the Research Association can obtain visitor tickets from the office (while stocks last). Email to office

 

Further information about the exhibition booth of 3-D MID e.V. at LOPEC can be found here.

Further information about LOPEC 2022 can be found here.

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