Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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The research association 3-D MID e.V. at Rapid.Tech 2019

The Research Association for Spatial Electronic Assemblies will also present itself in 2019 at Rapid.Tech + FabCon 3.D 2019 from June 25th to 27th 2019 in Erfurt. In 2018 the trade fair recorded 5,000 visitors, which means that the trade fair can record a permanent upward trend. At the trade fair for additive manufacturing, exhibitors, consisting of companies, research institutes, organisations and associations, presented their latest technologies and manufacturing services.

Picture: The booth of the research association 3-D MID e.V. at Rapid.Tech 2017

The research association will present itself and its members through selected demonstrators, posters and a monitor presentation. Members are welcome to register to exhibit via the demonstrators office.

Interested parties will find the stand of the Research Association in Hall 2, 2-1007. We look forward to your visit!

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