Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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IGF Project 20132 N – AgOn3D

Description

Silver sintered on 3D ceramic substrates for electronics in high temperature applications

 

Duration: 06/01/2018 – 05/31/2020

 

Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.

Research institutes and contact persons

For further contact details, please contact the office. E-Mail to office

 

Hochschule Aschaffenburg HAB – FIW

Christian Schwarzer

Wuerzburger Straße 45
63743 Aschaffenburg, GER

 

Friedrich-Alexander University Erlangen-Nuremberg

Institute for Factory Automation and Production Systems (FAPS)

Alexander Hensel

Fuerther Straße 246b
90429 Nuremberg, GER

www.faps.fau.eu

Documents

Documentation on the project is available in the members’ area or on request from the office at info@3dmid.de. E-Mail to office

If you are not a member yet, you will find information about membership here.

 

Project Application

Progress Report 2018

Progress Report 2019

Final Report

Source: Chair FAPS of FAU
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