Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Computer Man Member area

IGF Project 20132 N – AgOn3D


Silver sintered on 3D ceramic substrates for electronics in high temperature applications


Duration: 06/01/2018 – 05/31/2020


Objective: Use of ceramic substrate in conjunction with silver interconnect technology to extend the application to higher temperatures and harsh environments.

Research institutes and contact persons

For further contact details, please contact the office. E-Mail to office


Hochschule Aschaffenburg HAB – FIW

Christian Schwarzer

Wuerzburger Straße 45
63743 Aschaffenburg, GER


Friedrich-Alexander University Erlangen-Nuremberg

Institute for Factory Automation and Production Systems (FAPS)

Alexander Hensel

Fuerther Straße 246b
90429 Nuremberg, GER


Documentation on the project is available in the members’ area or on request from the office at E-Mail to office

If you are not a member yet, you will find information about membership here.


Project Application

Progress Report 2018

Progress Report 2019

Final Report

Summary of the final publication (freely accessible to all)

Source: Chair FAPS of FAU
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