Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Participation of the Research Association at the 31st FED Conference 2023

More than 360 people from the electronics industry attended the 31st FED Conference on 20 and 21 September 2023 in Augsburg. The organizer, Fachverband Elektronikdesign und -fertigung (FED), drew a positive conclusion: “With a new record number of visitors, the FED Conference once again provided the industry with an excellent platform for exchanging ideas and further training,” said Dieter Müller, FED Chairman. The event was themed: “Robust, sustainable and holistic – opportunities for electronics design and manufacturing in Europe”. With a tabletop booth, the Research Association 3-D MID e.V. showed impressive demonstrators from the fields of: LDS technology, laser sintering and piezo printing. At the same time, the offers and services of the research association were presented to a large number of visitors. The visitors were very interested in the current research projects. All in all, the participation in this event promoted the technology of spatial electronic assemblies and generated ideas for further development, taking into account the interests of the general public as joint research.

Photo: 3D MID e.V. advises visitors at the FED Conference 2023

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