Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Successful trade fair appearance of 3-D MID e.V. at the LOPEC 2024 in Munich

LOPEC 2024 in Munich was a complete success for 3-D MID e.V.. From March 6 to 7, Lukas Boxberger (Fraunhofer IWU), Nataliia Gromberg (Fraunhofer IWU), Daniel Utsch (Institute FAPS) and Silke Landvogt (3-D MID e.V.) presented the Research Association at the international trade fair and attracted numerous visitors to their stand at the International Congress Center Munich.


The trade fair appearance provided an excellent opportunity to present the wide range of possible applications for Mechatronic Integrated Devices. Visitors were informed about the innovative technologies and current research projects developed by the members of the research association.


The presence of 3-D MID e.V. at LOPEC made it possible to establish valuable contacts and deepen existing partnerships. New potential for cooperation and joint projects were identified through discussions with experts and interested parties from the industry.


The visitors’ interest in the research association’s offerings and the positive response to the research projects presented were particularly pleasing. This underlines the relevance and potential of printed electronics for the future of various industries.


Overall, 3-D MID e.V.’s presence at LOPEC 2024 was an important step towards increasing the visibility of the research association and consolidating its position as a leading player in the field of printed electronics. We would like to thank all visitors who visited our stand and look forward to future encounters and successful collaboration!

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