Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Program

MID Summit & MID Workshop

October 23 – 24, 2024 – Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, GER

Opening Session

9:15 AM

Welcome
Prof. André Zimmermann, Hahn-Schickard and Prof. Jörg Franke, 3-D MID e.V.

9:30 AM

Opening with Keynote
Prof. Florian Risch, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Applications + Technologies

10:00 AM

SolarTAP – A technology acceleration platform for emerging PV technology from the lab to the fab
Wolfgang Mildner, Project SolarTAP – Initiative der Helmholtz Institute

10:30 AM

Atmospheric plasma spray for current collectors in solid-state batteries
Andre Borchers, Fraunhofer Institute for Ceramic Technologies and Systems IKTS

11:00 AM

Additive manufacturing in power electronics
Dr. Thomas Stoll, TUM School of Engineering and Design

11:30 AM

Functional e-integration using wire encapsulating additive manufacturing
Lukas Boxberger, Fraunhofer-Institut für Werkzeugmaschinen und Umformtechnik IWU, Biomechatronik

12:00 PM

Lunch Break and Networking, Exhibition and Poster Session of Current Research Projects

1:00 PM

Next generation low loss & plateable LCP solutions
Otmar Bade, Celanese GmbH

1:30 PM

Bonding mechanisms of Copper Metallization via Atmospheric Plasma Spraying on Power Electronic Chips
Manuela Ockel, Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

2:00 PM

3D Ceramic circuits: Applications & benefits going beyond electronics
Frederik Luppens CERcuits BV

2:30 PM

Microscopy, spectroscopy and materials data to advanced sodium based solid state batteries
Prof. Silke Christiansen, Fraunhofer Institute for Ceramic Technologies and Systems IKTS

3:00 PM

Assembly and connection technologies on 3D-capable substrates
Kai Werum, Hahn-Schickard

3:30 PM

For Members: General Meeting of 3-D MID e.V. and Alternative Offer

For Non-Members: Speed Dating Session

4:30 PM

Networking, Exhibition and Poster Session of Current Research Projects

6:00 PM

Evening Event, Catering and Drinks

9:00 AM

Opening with Keynote
Prof. Alexander Brem, Institute of Entrepreneurship and Innovation Science (ENI)

Start-up Companies

9:45 AM

Tagless traceability for MIDs
Dr. Benedikt Wigger, Detagto GmbH

10:00 AM

Test methods for aluminium flex layer substrates
Martin Muckelbauer, Powerlyze GmbH

10:15 AM

Laboratory automation for R&D in printed electronics
Tobias Stubhan, Sciprios GmbH

10:30 AM

Coffee Break

10:45 AM

Digitally qualify circuit board layouts and THT soldering processes
Dr. Reinhardt Seidel, DEEPTRONICS GmbH

11:00 AM

Production technology for coil modules for inductive power transfer
Maximilian Kneidl, Seamless Energy Technologies GmbH

11:15 AM

Printed electronics – managing quality challenges
Wolfgang Mildner, TestCenter MSWtech/BayflexSolutions

11:30 AM

to be defined

12:00 AM

Lunch Break and Networking, Exhibition and Poster Session of Current Research Projects

Workshops

1:00 PM

Individual Workshops (choose your topic)

  • Design theory and similarity mechanics
    led by PD Dr. Stephan Rudolph
  • New research areas for MID
    led by Dr. Wolfgang Eberhardt, Dr. Andrea Knöller
  • 3D construction technology in power electronics
    led by Dr. Bernd Bitterlich
  • Printed 3D electronics
    led by Dr. Kerstin Gläser, Dr. Tobias Vieten

3:00 PM

Networking, Exhibition and Poster Session of Current Research Projects

3:30 PM

Summary of Workshop Results
Workshop leaders

4:00 PM

Summary of the Event and Outlook
Prof. André Zimmermann, Hahn-Schickard and Prof. Jörg Franke, 3-D MID e.V.

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