Wednesday, 21st September 2022
9:30 AM
Welcome by Ministerial Council Claus Mayer
Opening by Prof. André Zimmermann and Prof. Jörg Franke
10:00 AM
New Applications
Thomas Hess, HARTING AG
10:30 AM
Si-Wafer Replacement and MID LDS Transformer
Dr. Sebastian Bengsch, Ensinger
11:00 AM
Metalized-plastic Technology Enabling Three-dimensional Millimeter-wave Components
Prof. Jan Hesselbarth, Uni Stuttgart – IHF
11:30 AM
Advantages of 3D Circuit Design in an ECAD Tool
Christian Röck, Altium
12:00 AM
Networking, Exhibition and Poster Session of Current Research Projects with Light Snacks
Exhibitors: Henkel AG & Co. KGaA, Powerlyze GmbH, Fraunhofer IEM, Ensinger Sintimid GmbH, SENIN TECHNOLOGIES CORPORATION
1:00 PM
Metallization of Oxide Ceramic Substrates via Laserinduced Direct Metallization
Philipp Ninz, Uni Stuttgart – IFKB
1:30 PM
Evaluation of printed strain gauges on 2.5D substrates
Felix Häußler, FAU Erlangen-Nürnberg – FAPS
2:00 PM
3D Printed Chip Packaging
Dr. Ashok Sridhar, TNO Holst Centre
2:30 PM
Contacting Inkjet-Printed Silver Structures and SMD
Jonas Jäger, Hahn-Schickard
3:00 PM
Networking, Exhibition and Poster Session of Current Research Projects
Exhibitors: Henkel AG & Co. KGaA, Powerlyze GmbH, Fraunhofer IEM, Ensinger Sintimid GmbH, SENIN TECHNOLOGIES CORPORATION
4:00 PM
General Meeting 3-D MID e.V. alternatively Excursion to Hahn-Schickard – Focus on „Digital Process Chain for Individualized Microsystems“
7:00 PM
Evening Event in the Courtyard with Food Truck
Thursday, 22nd September 2022
9:00 AM
Smarter Surfaces for a Smarter Future
Markus Thamm, Salcon International
9:30 AM
Networking, Exhibition and Poster Session of Current Research Projects
Exhibitors: Henkel AG & Co. KGaA, Powerlyze GmbH, Fraunhofer IEM, Ensinger Sintimid GmbH, SENIN TECHNOLOGIES CORPORATION
10:00 AM
Retrofit Sensor Technology
Peter Peetz, IMS Connector Systems
10:30 AM
Rapid Prototyping of MID by Stereolithographic Printing
Dr. Hendrik Mohrmann, Contag
11:00 AM
Functionalized Otoplastic (MikroBO)
Hartmut Richter, Audifon
11:30 AM
Pad printing electronics – enabling the future of 3D connected surfaces
Aad van der Spuij, Henkel Belgium NV
12:00 AM
Networking, Exhibition and Poster Session of Current Research Projects and Light Snacks
Exhibitors: Henkel AG & Co. KGaA, Powerlyze GmbH, Fraunhofer IEM, Ensinger Sintimid GmbH, SENIN TECHNOLOGIES CORPORATION
1:00 PM
Workshops MID & Beyond
Topics: New Research Areas, Printed Hybrid Electronics, Sustainability, Market Research
3:00 PM
Networking, Exhibition and Poster Session of Current Research Projects
Exhibitors: Henkel AG & Co. KGaA, Powerlyze GmbH, Fraunhofer IEM, Ensinger Sintimid GmbH, SENIN TECHNOLOGIES CORPORATION
3:30 PM
Presentation of the Results from the Workshops
4:00 PM
Final Lecture and Farewell by Prof. André Zimmermann and Prof. Jörg Franke
