Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
+49 911 5302 9 9100
+49 911 5302 9 9102
Computer Man Mitgliederbereich

MID Summit & MID Workshop


MID Summit & MID Workshop

21st & 22nd September 2022 in Böblingen (near Stuttgart)

Hahn-Schickard and the Research Association 3-D MID e. V. will combine the events “MID Summit” and “MID Workshop” this year as a joint industry get-together on September 21st and 22nd in Böblingen (Stuttgart region).


We offer two intensive days around the MID topic with expert presentations from industry and research on MID Applications, New Materials and Technologies and Additive Manufacturing Processes. Furthermore, we offer poster sessions on current research projects and a trade exhibition with exhibitors such as Ensinger Sintimid GmbH, Chair FAPS (FAU), Fraunhofer IEM, Hahn-Schickard, Henkel AG & Co. KGaA, KNOWARE, Neotech AMT GmbH, Powerlyze GmbH, SENIN TECHNOLOGIES CORPORATION and Sunway Communication AB. On Thursday, the 22nd of September, you will have the opportunity to work in small groups in the workshops on topics such as New Research Areas, Printed Hybrid Electronics, Sustainability and Market Research.


In recent years, MID technology has evolved. This is reflected in the change of the name MID from Molded Interconnect Devices to Mechatronic Integrated Devices. New materials and processes have expanded the range of applications and possible functionalization of 3D circuit carriers. Additive manufacturing processes, for example, are opening up new routes for the rapid realization of prototypes and the individualization of products.


Take the opportunity to gain new insights, exchange ideas and network. Register for the event here.


We are looking forward to your visit!

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