Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Project FLA-Heat

IGF – Investigation of the influence of thermally conductive fillers on flame retardant substrate materials [FLA-HEAT]

 

Duration: 11/01/2021 – 10/31/2023

Research objective

Investigation of the influencing factors of thermally conductive fillers and their orientation on the flame retardant properties at different states of conditioning

  • Development of compounds combining thermal conductivity and improved flame retardancy
  • Knowledge of the essential influencing factors of the process-structure-property relationships as well as their interaction during injection moulding with regard to flame behaviour
  • Findings on the influence of thermally conductive fillers on ignition and flame propagation
  • Transfer of the developed compounds to the LDS process for the production of MID-structurable circuit carriers
  • Low-cost, highly conductive elastomers for printed, flexible electronics
Figure: Microscopic image of a laser-direct structured and metallized copper (Cu) / nickel (Ni) / gold (Au) conductor track on polyethylene terephthalate (PET) / polybutylene terephthalate (PBT) blend with details of the thermal expansion coefficients α of the individual layers; Source: Wang, L., Zhang, L., Fischer, A., Zhong, Y., Drummer, D., Wu, W.: Enhanced thermal conductivity and flame retardancy of polyamide 6/flame retardant composites with hexagonal boron nitride. Journal of Polymer Engineering 38 (2018), S. 767–774.

Expected use of the envisaged research results in SMEs

  • Use of the developed ink formulation in flexible electronics
  • Development of new innovative product ideas through extended possibilities
  • Winning new orders through better competitive position due to cheaper and more reliable inks
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