Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Hot Embossing

Important to hot embossing is the material of the foil, an electrolytically obtained copper with easily shearable crystalline structure.


Through-hole contacts are possible by embossing the foil into preformed holes in the substrate. These are subsequently filled with conductive paste. Hot embossing is a very quick and clean plating process.

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