Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Review of the 12th MID Day – Acoustic Interfaces & Power Electronics

On 8th November 2023, numerous interested participants followed the 12th MID Day online. There were two presentations. Firstly, the participants learned about the contacting (welding) of microchips on printed circuit boards for power electronics using a laser. The advantages are the extremely short contacting time, precise process control and savings on soldering and soldering processes. The start-up company iCuTech GmbH, represented by Managing Director Christian Göbl, has developed the processes and is about to introduce them for series production.


Secondly, Mr. Clemens Wegener from the Bauhaus University Weimar presented the technical possibilities for the prototypical production of MID assemblies with an unusual design. A new demonstrator was presented, which will be available for trade fairs and members of the research association in 2024.

Image: 3-D MID Showcase; Source: Clemens Wegener – Bauhaus University Weimar
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