Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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IGF-Project 18374 N – Duroplast-LDS-MID

Description

Investigations into the production of injection-moulded thermoset circuit carriers using LDS technology

 

Objective: Development of new thermoset materials for the production of MIDs by means of laser direct structuring.

Research institutes and contact persons

For further contact details, please contact the office. E-Mail to office

 

Hahn-Schickard

Dr. Wolfgang Eberhardt

Allmandring 9 B
70569  Stuttgart, GER

www.hahn-schickard.de/en/

 

Friedrich-Alexander University Erlangen-Nuremberg

Institute for Polymer Technology (LKT)

Andreas Fischer

Am Weichselgarten 9
91058 Erlangen, GER

www.lkt.tf.fau.eu

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