Development of a ceramic injection molded 3D circuit carrier for contacting and integration of power electronics by means of low-resistance active solder.
Objective: Development of methods and the possibility of introducing active solder-based electrical conductor paths into ceramic injection-moulded structures, which can be used to contact and integrate power electronic components.
Research institutes and contact persons
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Institute for Production Science (wbk)
76131 Karlsruhe, GER
Institute for Applied Materials – Applied Materials Physics (IAM-AWP)
Dr. Magnus Rohde
Friedrich-Alexander University Erlangen-Nuremberg
Institute for Factory Automation and Production Systems (FAPS)
Fuerther Straße 246b
90429 Nuremberg, GER
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