Description
Development of a ceramic injection molded 3D circuit carrier for contacting and integration of power electronics by means of low-resistance active solder.
Objective: Development of methods and the possibility of introducing active solder-based electrical conductor paths into ceramic injection-moulded structures, which can be used to contact and integrate power electronic components.
Research institutes and contact persons
For further contact details, please contact the office. E-Mail to office
Institute for Production Science (wbk)
Elisa Goetze
Kaiserstraße 12
76131 Karlsruhe, GER
Institute for Applied Materials – Applied Materials Physics (IAM-AWP)
Dr. Magnus Rohde
Kaiserstraße 12
76131 Karlsruhe,GER
Friedrich-Alexander University Erlangen-Nuremberg
Institute for Factory Automation and Production Systems (FAPS)
Thomas Stoll
Fuerther Straße 246b
90429 Nuremberg, GER
Documents
Documentation on the project is available in the members’ area or on request from the office at info@3dmid.de. E-Mail to office
If you are not a member yet, you will find information about membership here.
1) Project Meeting Minutes 12/07/2016
1) Project Meeting Presentation 12/07/2016
2) Project Meeting Minutes 12/05/2017
2) Project Meeting Presentation 12/05/2017
Progress Report 10/2016 – 04/2018
3) Project Meeting Minutes 06/13/2018
