Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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MID Summit 2019 – the new platform for MID technologies

In the course of the 30th ordinary general meeting of the research association 3-D MID e.V. on 21.05.2019, during the MID Summit in Nuremberg on the AEG grounds in hall 15, Prof. Dr. Jörg Franke was re-elected in his function as chairman of the board. The holder of the Chair of Manufacturing Automation and Production Systems has been Chairman of the Board since April 2010 and is constantly working on further developing MID technology and consolidating the research association as a joint network. This includes in particular the further development of the term MID from Molded Interconnect Devices to Mechatronic Integrated Devices, so that an entire technology portfolio for the functionalization of spatial bodies is combined.

In addition to Prof. Franke, Dr. Christian Goth (CPT Zwei GmbH) and Dr. Andreas Pojtinger (2E mechatronic GmbH & Co. KG) were confirmed as deputy board members.

Accompanying the general meeting the first MID Summit took place in the same location. It was very well received and served to network and present the members. In addition to the lectures and presentations of the research projects of the research association, there were also many opportunities for technical discussions and exchange among the members as well as with interested visitors.

In numbers:

  • Over 100 visitors
  • 4 lectures from the field of research
  • 5 lectures from the business world
  • 10 posters on current research projects
  • 21 additional exhibitors

Impressions:

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