Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Invitation to the MID Summit & MID Workshop 2022

Hahn-Schickard and the Research Association 3-D MID will combine the events “MID Summit” and “MID Workshop” this year as a joint industry get-together on September 21st and 22nd in Böblingen (Stuttgart region).

 

The MID Summit & MID Workshop offers two intensive days around the MID topic with expert presentations from industry and research with many application examples, poster session, trade exhibition and plenty of time for exchange and networking.

 

In recent years, MID technology has evolved. This is reflected in the change of the name MID from Molded Interconnect Devices to Mechatronic Integrated Devices. New materials and processes have expanded the range of applications and possible functionalization of 3D circuit carriers. Additive manufacturing processes, for example, are opening up new routes for the rapid realization of prototypes and the individualization of products.

 

Take the opportunity to gain new insights and exchange ideas.

 

We are looking forward to your visit!

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Accommodation

You are welcome to take advantage of our discounted rates at Hotel Rieth. The hotel is located only 600 m from the venue.

 

Hotel Rieth

Single room: 92,00 EUR per night (incl. breakfast buffet, Wifi, parking, taxes)

Note: Please book by e-mail (info@hotel-rieth.de) and refer to the price conditions given here.

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Trade exhibition

If you are interested in presenting your institute or company at the trade exhibition on September 21st with a table top presentation, please feel free to register here.

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