Look forward to two fascinating research presentations at the 15th MID Time on August 7, 2024. The virtual event starts at 4 pm (CET) and is free of charge for all interested parties. After the 20-minute presentations, there will be a Q&A session followed by a networking opportunity for presenters and participants. The event will be held in English.
First, Markus Ankenbrand (FAPS) will give the presentation “Additive manufacturing of helical antennas with aerosol jet and laser direct structuring”.
The presentation will explore the advantages and methods of manufacturing helical antennas using advanced manufacturing technologies. Helix antennas are well-suited for WLAN and GPS because they can send and receive circularly polarized signals, making them very effective for these applications.
The presentation explains how different 3D printing technologies, like Fused Filament Fabrication (FFF) and Digital Light Synthesis (DLS), are used to create the antenna bases. It also covers how conductive pathways are added using Aerosol-Jet printing and Laser Direct Structuring (LDS).
Materials such as PEEK, epoxy, and polycarbonate for the bases, and silver and copper for the conductive traces are used. The presentation discusses challenges like ink spreading and short circuits during manufacturing.
Finally, the performance of these 3D-printed antennas is characterized, showing how surface quality and manufacturing accuracy affect their function. The presentation highlights the potential and challenges of using these new technologies to meet the growing needs of modern communication and IoT devices.
Image: Aerosol-Jet printing of a helix antenna; source: FAPS (FAU Erlangen-Nürnberg)
Image: Concept for a smart seal ; source: IMA Stuttgart
Niklas Piechulek (FAPS) will then present the “SmartSeal” research project – the future of radial seal monitoring with pioneering MID temperature measurement systems.
The SmartSeal project aims to revolutionize radial seal monitoring using advanced wearable technology principles. This system measures the sealing lip temperature to assess the health state of the seal, enabling predictive maintenance by estimating its remaining service life. Key challenges include indirect temperature measurement, reliable energy supply, and hardware integration within the limited, curved space of the shaft sleeve. Solutions involve a sensor array, space-efficient circuit design, and System on a Chip (SoC) integration. Inductive energy harvesting, the development of temperature-resistant 3D Mechatronic Integrated Devices (3D-MIDs), and SLA printing of 3D-MIDs are also crucial. Extensive miniaturization efforts further enhance the system’s robustness and efficiency, paving the way for precise condition monitoring and maintenance prediction.
