Thermomechanically optimized design and manufacturing process of customized power electronic substrates with integrated cooling structures through innovative design and multimaterial Vat Photopolymerization
Duration: 01 July 2026 – 30 June 2028
Description
The increasing electrification, the use of wide-bandgap (WBG) semiconductors, and rising demands for efficiency and power density pose new technological challenges for power electronics. Conventional substrate and cooling concepts, such as Direct Copper Bonding (DCB) or Active Metal Brazing (AMB), are reaching their limits due to restricted design flexibility and high thermomechanical loads. Particularly in compact and highly integrated systems for applications such as electromobility, renewable energy, aerospace, and power engineering, new manufacturing approaches are required to enable efficient heat dissipation, reduced electrical losses, and high reliability.
This project develops an additive multimaterial manufacturing approach based on vat photopolymerization (VPP) for the direct fabrication of highly integrated copper-ceramic power electronic modules. By jointly processing electrically insulating high-performance ceramics and metallic conductor structures, substrates, electrical functionalities, and thermal management structures will be realized within a single integrated manufacturing process. This enables novel three-dimensional component architectures with optimized conductor layouts, variable layer structures, and application-specific cooling geometries that are difficult or economically unfeasible to manufacture using conventional production methods.
To achieve this, material, process, and design strategies will be systematically combined. Ceramic and metallic slurry systems will be further developed, co-sintering strategies for the joint thermal treatment will be investigated, and approaches for compensating different shrinkage and thermal expansion behaviors will be established. In addition, simulation-based methods will be applied to evaluate thermal and thermomechanical loads during the development phase and to derive optimized geometries using topology optimization.
The developed material systems and component concepts will be validated through comprehensive material characterization, thermal and mechanical testing, as well as lifetime investigations. Based on these results, design guidelines for additively manufactured metal-ceramic composites and a transferable concept for the reliable design of future power electronic modules will be established. The combination of tool-free manufacturing, high design freedom, and functionally integrated components enables SMEs in particular to develop flexible and economically viable customized solutions, thereby strengthening their competitiveness in future-oriented technology fields.
Research Objective
The aim of the research project is the development of an additively manufactured, simulation-driven optimized copper-ceramic power module using vat photopolymerization (VPP), enabling enhanced thermal, electrical, and thermomechanical performance through targeted material, process, and design adaptations. To achieve this, novel slurry and sintering strategies will be developed for the co-processing of ceramic and metallic materials, while optimized component geometries will be derived through simulation and topology optimization. The reliability of the developed structures will be validated through experimental testing and lifetime models. The project will establish design guidelines for highly integrated and durable metal-ceramic composites, unlocking the potential of additive multimaterial manufacturing for future power electronic applications.
Benefits and Economic Significance for SMEs:
- Access to innovative substrate and cooling technologies: The development of a tool-free additive manufacturing technology for functionally integrated copper-ceramic components enables the production of individually optimized power electronic components.
- Reduced development and manufacturing costs: The elimination of complex tooling and process chains enables cost-efficient prototyping, pre-series, and small-batch production with significantly shortened development cycles.
- Increased design freedom and customization: Additive multimaterial manufacturing enables the realization of application-specific geometries, integrated cooling structures, and optimized conductor layouts without costly process adaptations.
- New business opportunities and value chains: The developed technology opens up new market opportunities in the fields of power electronics, electromobility, renewable energy, aerospace, and medical technology.
- Enhanced product performance: Optimized thermal and electrical properties enable the development of more compact, powerful, and reliable electronic systems.
- Resource and energy efficiency: Functional integration, reduced material usage, and extended component lifetime contribute to sustainable product solutions and reduced environmental impact.
Research institutes and contact persons
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- Karlsruhe Institute of Technology (KIT) – wbk Institute of Production Science
- Friedrich-Alexander-Universität Erlangen-Nürnberg Institute for Factory Automation and Production Systems
