Research Association at LOPEC 2026: Innovations in Printed Electronics
LOPEC in Munich is one of the world’s leading events for printed electronics, additive manufacturing, and flexible electronics. Once again this year, the trade fair provided an excellent platform for exchange between research, industry, and young talents.
Our team was present on site to present and discuss the latest developments in 3D-MID technologies, innovative metallization methods, and additive manufacturing.
Technical Exchange as Session Chair
As Session Chair, Florian Risch moderated several exciting technical presentations and accompanied discussions on current developments from both research and industry.
The sessions offered valuable insights into new technologies and trends in printed electronics, additive manufacturing, and mechatronic integration concepts.
Intensive Discussions at the Exhibition Booth
At our exhibition booth, we had numerous inspiring conversations with visitors from various backgrounds – ranging from students and industry experts to project partners.
Particular interest was shown in our latest developments in the areas of:
- Innovative metallization methods
- Additive manufacturing technologies
- 3D-MID and integrated electronic solutions
The exchange with the international community once again demonstrated how dynamic and innovation-driven this technological field is.
Research Projects Attracting Strong Interest
Our current research projects attracted significant attention from trade fair visitors:
IGF ASAP-MID
The IGF ASAP-MID project investigates the feasibility and quality of metallization on 3D-printed silicone in order to enable stretchable and flexible additive mechatronic products.
The goal is to open up new applications in flexible electronics and additive manufacturing.
IGF Metawave
The IGF Metawave project focuses on the selective metallization of 3D-printed dielectric waveguides for feed networks in high-frequency applications.
DFG 3D-HF-MID
The DFG research group 3D-HF-MID develops 3D-MID structures for high-frequency technology, for example for slotted waveguide antennas and other innovative RF applications.
Networking with Industry and Research
In addition to the technical discussions, the trade fair offered excellent opportunities to connect with the international electronics and MID community.
We were able to:
- meet new potential industrial partners
- strengthen existing collaborations with current and former project partners
- further promote the exchange between research, industry, and young scientists
Acknowledgements
A special thank you goes to the FAPS team for their support and the excellent cooperation on site.
We would also like to thank:
- Ece Karadag
- Kok Siong Siah
- Daniel Utsch
- Markus Ankenbrand
- Lukas Gugel
for capturing great snapshots during the event.
Many thanks as well to Markolf Hoffmann from PULS GmbH for providing the photos.📸 Photographer: Jonas Jahnel
Outlook
We look forward to continuing the exchange within the community and to meeting again at the next LOPEC.
