15th International MID Congress
21st – 22nd June 2023, Amberger Congress Centrum (ACC), Germany
Opening Session (Prof. J. Franke)
9:30 AM
Welcome & Opening, Prof. J. Franke, University of Erlangen-Nuremberg – FAPS / Chairman of 3-D MID
10:00 AM
New Application in the Field of Laser direct structuring, Michael Mross, HARTING AG, CH
10:30 AM
Awarding Ceremony Best Paper / MID Advancement, Prof. Dr.-Ing. André Zimmermann, Hahn-Schickard-Gesellschaft e.V., GER
10:45 AM
Coffee Break
Session 1: Industrial Applications I (Dr. C. Jürgenhake)
11:15 AM
Micro-CT meets 3D elemental analysis – The new SPECTRAL CT, Dr. Lars-Oliver Kautschor, TESCAN, CZ
11:40 AM
3D Mechatronic Systems via Printed Electronics, Dr. Martin Hedges, Neotech AMT, GER
12:05 PM
Radio-Frequency Energy Harvesting Using Rapid 3D-Plastronics, Dr. Michel Cabrera, AMPERE Lab – INSA, FRA
12:30 PM
Lunch Break
Session 2a: Innovative Materials (Dr. J. Heyer)
1:45 PM
Sustainability with High Performance Polymers, Prof. Dr. Karl Kuhmann, Evonik Operations GmbH
2:10 PM
Study for Implementation of Electronic Circuits into Multifunctional Miniaturized Thermoplastic Enclosures, Luciano Rietter, PIEP – Innovation in Polymer Engineering, PRT
2:35 PM
Sustainability driven LDS Developments, Hans Wilderbeek, Mitsubishi Chemical Europe Technical Center B.V., NL
3:00 PM
Coffee Break
Session 2b: Ceramics (Prof. Dr. A. Zimmermann)
1:45 PM
Additive Manufacturing of Multi-Material Ceramic Components, Dr. Zouwen Fu, Research Institute for Glass – Ceramics Höhr-Grenzhausen, GER
2:10 PM
Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication, Daniel Utsch, Institute for Factory Automation and Production Systems, GER
2:35 PM
Ceramics for Solid Substrate Batteries or LITOS (A), Prof. Dr.-Ing. Silke Christiansen, Fraunhofer Institute IKTS, GER
3:00 PM
Coffee Break
Session 3a: Printed Electronics – Applications and Potentials (Prof. M. Reichenberger)
3:30 PM
The Classification of Additively Manufactured Electronics (AME), Michael Schleicher, Semicron Danfoss, GER
3:55 PM
Digitally Printed Strain Gauges on 3D Metallic Objects for Pressure Sensing, Jewgeni Roudenko, University of Technology Nuremberg, GER
4:20 PM
Poster Session
Session 3b: Alternative Manufacturing Processes (J. Obermaier)
3:30 PM
Results Research Project MiniHelix – Miniaturization of Helix Antennas for HF Applications by MID Manufacturing Process, Markus Ankenbrand, Institute FAPS (FAU Erlangen-Nürnberg), GER
3:55 PM
3D Piezo Inkjet Printing and Microwave Sintering of Conductive Paths – Selected Examples, Mike Frahm, TH Wildau, GER
4:20 PM
Poster Session
5:05 PM
End of Sessions
6:30 PM
Evening Event
Session 4a: Printed Electronics – Pre- and Postprocessing (Dr. A. Reinhardt)
9:00 AM
How to Manage Quality Challenges, when Scaling Up Printed or 3D MID Electronics Applications, Wolfgang Mildner, MSWtech, GER
9:25 AM
Crimp Interconnection of Rigid and Flexible Circuit Carriers Utilizing Silver-Containing Printed Conductive Structures, Michael Hümmer, Technische Hochschule Nuremberg, GER
9:50 AM
3D Multilayer Printing of 3D Multilayer Devices, Keno Pflieger, Leibniz University Hannover, GER
10:20 AM
Coffee Break
Session 4b: Materials Research (Dr. T. Reitberger)
9:00 AM
Hybrid Design Approach for the Design of High-Frequency Components in MID Technology, Thomas Mager, Fraunhofer Institute IEM, GER
9:25 PM
Investigation of LDS-capable PEEK/PEI Blends for Customizable Multilayer LDS-MID for Fabrication of Millimeter Wave-Capable High Frequency Module, Marius Wolf, Hahn-Schickard e.V., GER
9:50 AM
Copper Wave Springs for Electromechanical-Applications, Jan Philip, Kern & Liebers, GER
10:20 AM
Coffee Break
Session 5a: Development and Coating-Based Functionalization (W. Mildner)
10:45 AM
NanoMID – a Novel Approach to (Structured) Metallisation on Nearly Every Material, Randolf Hofmann, MID-Solutions, GER
11:15 AM
Selective Surface Activation Induced by Laser (SSAIL) – Technology of Electric Circuit Formation on Various Dielectrics, Dr. Karolis Ratautas, Center for Physical Sciences and Technology & AKONEER, LIT
11:45 AM
High Speed Galvanic Reactors for Reinforcement of Small Conductive Layers, Dr. Bernd Heitkamp, Gramm Technik GmbH, GER
Session 5b: Additive Manufacturing (Prof. Dr. K. Kuhmann)
10:45 AM
Mosquito Dispensed Waveguides in Cavities on 3D-MID, Laura Fütterer, Leibniz University Hannover – Institute of Transport and Automation Technology & Laser Zentrum Hannover e.V., GER
11:15 AM
Additively Manufactured Electronics – More Functionality at Shorter Lead Time, Georg Cerwenka, Fraunhofer Institute IAPT, GER
11:45 AM
Radio-Frequency Energy Harvesting Using Rapid 3D-Plastronics, Dr. Tony Gerges, Laboratoire AMPERE – INSA de Lyon, FRA
12:20 PM
Closing Words
12:35 PM
Lunch Break
1:30 PM
End of Congress
2:00 PM
Technical Tour
3:45 PM
End of Technical Tour
