Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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Computer Man Mitgliederbereich

MID Summit & MID Workshop

JOINT EVENT

MID Summit & MID Workshop

23rd & 24th October 2024 in Vaihingen (near Stuttgart), GER

Wednesday, 23rd October &
Thursday, 24th October 2024

daily 9:00 AM until 5:00 PM (CEST)

Hahn-Schickard and the Research Association 3-D MID e. V. will combine the events “MID Summit” and “MID Workshop” as a joint industry get-together on October 23 and 24 in Vaihingen.

 

We offer two intensive days around the MID topic with expert presentations from industry and research on MID Applications, New Materials and Technologies and Additive Manufacturing Processes. Furthermore, we offer poster sessions on current research projects and a trade exhibition. On Wednesday, the 23rd of October, you will have the opportunity to work in small groups in the workshops on topics such as New Research Areas, Printed Hybrid Electronics, Sustainability and Market Research.

 

In recent years, MID technology has evolved. This is reflected in the change of the name MID from Molded Interconnect Devices to Mechatronic Integrated Devices. New materials and processes have expanded the range of applications and possible functionalization of 3D circuit carriers. Additive manufacturing processes, for example, are opening up new routes for the rapid realization of prototypes and the individualization of products.

 

Take the opportunity to gain new insights, exchange ideas and network. Register for the event here.

 

We are looking forward to your visit!

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