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LOPEC

The Research Association 3-D MID at LOPEC – trade fair for printed electronics

23rd or 25th March 2021 at Neue Messe, Munich

Source: LOPEC

The Research Association 3-D MID will once again be taking part in the international trade fair for printed electronics – LOPEC – in Munich. On March 23rd or 25th 2021, the Research Association will present itself to the numerous trade fair and congress visitors and inform them about the diverse application possibilities of mechatronic integrated devices, their members and their offers as well as current research projects in the field of printed electronics.

In 2019, over 2,700 participants from 44 countries visited LOPEC at Messe Munich. Next year, the organisers are expecting a significant increase too. Exhibitors from all areas of printed electronics technology will meet users from a wide range of industries at this cross-sectional trade fair.

 

Like every year, the LOPEC Congress will take place at the same time as the exhibition, with a separate session on the topic of 3-D MID.

 

Members of the Research Association can obtain visitor tickets at the office while stocks last. Email to office

 

Further information can be found at www.lopec.com

3D-MID booth at Lopec 2018; Source: 3D-MID

Further reports about LOPEC

MID Session at LOPEC chaired by Prof. Dr. Franke

Dear Colleague,

 

At the upcoming LOPEC Conference from March 23–25, 2021 in Munich, I will chair the session MID of the Technical Conference. I would be very pleased if you would apply for a presentation slot or for exhibiting a poster.

 

Together with the accompanying exhibition, the LOPEC Conference is one of the most important annual platforms worldwide in the field of printed electronics. At last more than 200 contributions from 25 countries could be experienced.

The Conference structure—Business, Technical and Scientific Conference—ensures that you speak to the right audience, whether it is current business models, innovative developments or research results. For further information please click here.

 

Starting on September 3, 2020, you can submit your abstract (in English please, max. 3,000 characters incl. spaces) directly to LOPEC online here; the submission deadline is October 16, 2020. An international panel of experts will then review and decide which topics will be selected and put together the presentation program.

 

If you are accepted for an oral presentation or a poster, you will be eligible for a discounted conference ticket (Academic Ticket). Please note that a valid conference ticket is required in order to participate as a speaker or to present a poster.

 

If you do not plan to participate as a speaker, attending the Conference is certainly also worthwhile. To receive information about ticket availability early on, please register for the LOPEC newsletter here.

 

Whether on stage or in the audience: I would be delighted to welcome you at the upcoming LOPEC Conference!

 

Best regards,

Prof. Dr. Franke

Chairman 3-D MID

Successful participation of 3-D MID at LOPEC

Also this year the Research Association 3-D MID successfully took part in the LOPEC from 20th – 21st March 2019 in Munich. The leading trade fair for printed electronics offered a broad platform for exchange and networking. Through the exhibition of selected exhibits, as well as posters and a monitor presentation, the Research Association presented itself and its members. The 3D-MID technology caught the interest of many visitors and attracted interesting as well as purposeful technical discussions. Companies and research institutes showed great interest in the Research Association and its members, as well as further research into the possibilities of MID technology through research projects.

The increasing number of visitors to the trade fair, which even with its 2,700 participants, has set a new visitors record, according to the final report, shows that printed electronics is still on the technological advance. Through the various exhibits, the Research Association successfully presented their understanding of MID as Mechatronic Integrated Devices and thus addressed a broad mass of visitors from different technological fields. Motivated by the positive feedback, the Research Association sees the field of MID technology continue to expand and looks confidently into the future.

3-D MID presents their technologies to the visitors; Source: 3-D MID
 
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