Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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LOPEC 2020 will not take place

Due to the increasing spread of the coronavirus (COVID-19) in Europe and on the basis of the recommendation of the Bavarian State Government and the responsible health authorities, Messe Munich feels compelled to cancel LOPEC 2020.


You can find more information here.

The Research Association 3-D MID e.V. at LOPEC – trade fair for printed electronics

24 to 26 of March 2020 at Neue Messe, Munich

The Research Association 3-D MID e.V. will once again be taking part in the international trade fair for printed electronics – LOPEC – in Munich this year. On March 25th or 26th 2020, the research association will present itself to the numerous trade fair and congress visitors and inform them about the diverse application possibilities of spatial electronic assemblies, their members and their offers as well as current research projects in the field of printed electronics.

If you are interested in a visitor ticket, please contact us. Email to office

Picture 1: 3D-MID booth at Lopec 2018
Source: 3D-MID e.V.

Last year, over 2,700 participants from 44 countries visited LOPEC at Messe Munich, and this year, too, the organisers are expecting a significant increase. Exhibitors from all areas of printed electronics technology will meet users from a wide range of industries at this cross-sectional trade fair. The focus this year will be on Smart Living and Mobility.

Like every year, the LOPEC Congress will take place at the same time as the trade fair, with a separate session on the topic of 3-D MID.

Interested? Visit us on March 25th or 26th 2020 at LOPEC (Messe Munich, Hall B0, Stand 517). Members of the Research Association can obtain visitor tickets at the office while stocks last.

Further information can be found at

Successful participation of Research Association 3-D MID e.V. at LOPEC

Also this year the Research Association 3-D MID e.V. successfully took part in the LOPEC from 20th – 21st March 2019 in Munich. The leading trade fair for printed electronics offered a broad platform for exchange and networking. Through the exhibition of selected exhibits, as well as posters and a monitor presentation, the Research Association presented itself and its members. The 3D-MID technology caught the interest of many visitors and attracted interesting as well as purposeful technical discussions. Companies and research institutes showed great interest in the Research Association and its members, as well as further research into the possibilities of MID technology through research projects.

The increasing number of visitors to the trade fair, which even with its 2,700 participants, has set a new visitors record, according to the final report, shows that printed electronics is still on the technological advance. Through the various exhibits, the Research Association successfully presented their understanding of MID as Mechatronic Integrated Devices and thus addressed a broad mass of visitors from different technological fields. Motivated by the positive feedback, the Research Association sees the field of MID technology continue to expand and looks confidently into the future.

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