The virtual international MID Congress 2021 will take place from 8th to 11th February 2021, daily from 2:30 PM until 6 PM.
Below you will find the program for each day of the MID Congress.
10:00 AM
Industrial Exhibition
1:00 PM
Break
2:00 PM
Opening & MID Award, Prof. J. Franke, University of Erlangen-Nuremberg – FAPS / Chairman of 3-D MID
Session 1: Industrial Applications I (Dr. C. Goth)
2:30 PM
3D-MID Antenna Challenges and Learnings, U. Palin, Sunway, SWE
2:55 PM
Proprietary 3D-MIDs – How a component carrier replaces flexible PCBs, T. Hess, HARTING, CH
3:20 PM
Silicon wafer replacement using LDS technology – Lithography free manufacturing of microsystems,
S. Bur / S. Bengsch, Ensinger / LUH – IMPT, GER
3:45 PM
Break
Session 2: Laser Based Processes (Prof. M. Reichenberger)
3:50 PM
Injection compression molding for manufacturing of LDS-MID based millimeter wave,
M. Wolf, Hahn-Schickard, GER
4:15 PM
Printing of laser-generated conductive copper tracks on 3D components, E. Olsen, LUH – ITA, GER
4:40 PM
Generation of printed electronics on thermal sensitive substrates by laser assisted sintering of nanoparticle inks, E. Mayer, BLZ, GER
5:05 PM
Break
Session 3: Alternative Manufacturing Processes (Dr. C. Plueg)
5:10 PM
Aerosol jet printed silver nanowires electrode and PEDOT:PSS layers of organic light-emitting diode devices, M. Khairulamzari Hamjah, FAU – FAPS, GER
5:35 PM
Repair techniques for MID-functionalized aircraft cabin linings, J. Sabban, Fraunhofer IAP, GER
10:00 AM
Industrial Exhibition
1:00 PM
Break
2:00 PM
Rapid-Networking
Session 4: Industrial Applications II (Dr. J. Heyer)
2:30 PM
Next generation LDS materials – Market trends induce new requirements,
F. Van Vehmendahl, MEP Europe, NL
2:55 PM
Application Specific Electronics Packaging (ASEP): Multi-layer, Electroplated, High-Power MIDs,
A. Han, Molex, USA
3:20 PM
Break
Session 5: Simulation, Design and Reliability (Dr. A. Reinhardt)
3:25 PM
Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring, L. Wang, FAU – FAPS, GER
3:50 PM
Approach for a modular design methodology for an efficient development of 3D MID components,
T. Mager, Fraunhofer IEM, GER
4:15 PM
Numerical and experimental analysis of injection molding processes with assembled film electronics,
A. Wimmer, University of Applied Science Hof, GER
4:40 PM
Evaluation of Mechanical Stress on Electronic Components During Thermoforming and Injection Moulding for Conformable Electronics, J. Schirmer, TH Nuremberg, GER
5:05 PM
Break
Session 6: Additive Manufacturing Processes (Dr. K. Kuhmann)
5:10 PM
Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, F. Hemmelgarn, Fraunhofer IEM, GER
5:35 PM
Development of an additive manufactured 3D-circuit carrier made of ceramic for contacting and integration of power electronics by using low-resistance active solder, M. Rosen, KIT, GER
6:00 PM
Novel manufacturing process for the additive production of 3D MID components using stereolithographic printing, T. Mager, Fraunhofer IEM, GER
10:00 AM
Industrial Exhibition
1:00 PM
Break
2:00 PM
Rapid-Networking
Session 7: Industrial Application III (J. Obermaier)
2:30 PM
Potential of Additive Manufacturing (AM) in electronic production, M. Schleicher, SEMIKRON, GER
2:55 PM
Printed Electronics Design Challenges, A. Becerra Esteban, Altium Europe, GER
3:20 PM
Break
Session 8: 3D Optoelectronics I (Prof. A. Zimmermann)
3:25 PM
Conditioning of Flexible Substrates for the Application of Polymer Optical Waveguides,
G.-A. Hoffmann, LUH – ITA, GER
3:50 PM
Surface Functionalization of Flexographic Printing Forms for Wetting Behavior Adjustment,
A. Wienke, LZH, GER
4:15 PM
Fabrication of Polymer Optical Waveguides via Aerosol Jet Printing, M. Khairulamzari Hamjah, FAU – FAPS, GER
4:40 PM
Break
Session 9: 3D Optoelectronics II (Dr. A. Pojitinger)
4:45 PM
Asymmetric Optical Bus Coupling Using 3D-Opto-MID, Dr. L. Lorenz, TU Dresden – IAV, GER
5:10 PM
Computer Aided Design and Modeling of 3D-Opto-MID, J. Zeitler, Neotech, GER
5:35 PM
Simulation Analysis of 3D Printed Polymer Optical Waveguides, C. Backhaus, FAU – ODEM, GER
10:00 AM
Industrial Exhibition
1:00 PM
Break
2:00 PM
Rapid-Networking
Session 10: Industrial Application IV (H. Rohde)
2:30 PM
Development of EMC for LDS MID that enables high-density 3D semiconductor packages and high-speed signal transmission modules, M. Endo, Sumitomo, JP
2:55 PM
Active Mold Packaging – A D-Band mmWave-Frequency Dielectric Characterization, F. Roick, LPKF, GER
3:20 PM
Electronics go 3D, W. Mildner, MSWtech, GER
3:45 PM
Break
Session 11: Packaging and Integration (Dr. R. Krueger)
3:50 PM
3D Conductive Tracks on Thermoset Packages for Advanced System Integration, S. Petillon, Hahn-Schickard, GER
4:15 PM
Assembly and encapsulation of LED modules on a mechanical flexible textile wound dressing for blue light therapy, F. Janek, Hahn-Schickard, GER
4:40 PM
Break
Session 12: Printed Electronics (W. Mildner)
4:45 PM
Sintering of printed conductive structures by using microwave irradiation for the application of energy, Dr. L. Hartmann, Fraunhofer IAP, GER
5:10 PM
New approach to the characterization of printed electronics and the homogeneity of sintering using RF, S. Neermann, FAU – FAPS, GER
5:35 PM
Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- and UV-radiation, J. Roudenko, TH Nuremberg, GER
6:00 PM
Closing Words & Best Paper Award, Prof. J. Franke, University of Erlangen-Nuremberg – FAPS / Chairman of 3-D MID, GER