Der virtuelle internationale MID Kongress 2021 findet vom 8. bis 11. Februar 2021 täglich von 14:30 bis 18:00 Uhr statt.
Nachfolgend finden Sie das Programm der vier Tage.
10:00
Industrieausstellung
13:00
Pause
14:00
Eröffnung & MID Förderpreis, Prof. J. Franke, FAU Erlangen-Nürnberg – FAPS / Vorstandsvorsitzender des 3-D MID e.V.
1. Sitzung: Industrial Applications I (Dr. C. Goth)
14:30
3D-MID Antenna Challenges and Learnings, U. Palin, Sunway, SE
14:55
Proprietary 3D-MIDs – How a component carrier replaces flexible PCBs, T. Hess, HARTING, CH
15:20
Silicon wafer replacement using LDS technology – Lithography free manufacturing of microsystems,
S. Bur / S. Bengsch, Ensinger / LUH – IMPT, DE
15:45
Pause
2. Sitzung: Laser Based Processes (Prof. M. Reichenberger)
15:50
Injection compression molding for manufacturing of LDS-MID based millimeter wave,
M. Wolf, Hahn-Schickard, DE
16:15
Printing of laser-generated conductive copper tracks on 3D components, E. Olsen, LUH – ITA, DE
16:40
Generation of printed electronics on thermal sensitive substrates by laser assisted sintering of nanoparticle inks, E. Mayer, BLZ, DE
17:05
Pause
3. Sitzung: Alternative Manufacturing Processes (Dr. C. Plüg)
17:10
Aerosol jet printed silver nanowires electrode and PEDOT:PSS layers of organic light-emitting diode devices, M. Khairulamzari Hamjah, FAU – FAPS, DE
17:35
Repair techniques for MID-functionalized aircraft cabin linings, J. Sabban, Fraunhofer IAP, DE
10:00
Industrieausstellung
13:00
Pause
14:00
Rapid-Networking
4. Sitzung: Industrial Applications II (Dr. J. Heyer)
14:30
Next generation LDS materials – Market trends induce new requirements,
F. Van Vehmendahl, MEP Europe, NL
14:55
Application Specific Electronics Packaging (ASEP): Multi-layer, Electroplated, High-Power MIDs,
A. Han, Molex, USA
15:20
Pause
5. Sitzung: Simulation, Design and Reliability (Dr. A. Reinhardt)
15:25
Simulation Assisted Characterization of Attenuation at Microstrip Transmission Lines fabricated by Laser Direct Structuring, L. Wang, FAU – FAPS, DE
15:50
Approach for a modular design methodology for an efficient development of 3D MID components,
T. Mager, Fraunhofer IEM, DE
16:15
Numerical and experimental analysis of injection molding processes with assembled film electronics,
A. Wimmer, Hochschule Hof, DE
16:40
Evaluation of Mechanical Stress on Electronic Components During Thermoforming and Injection Moulding for Conformable Electronics, J. Schirmer, TH Nürnberg, DE
17:05
Pause
6. Sitzung: Additive Manufacturing Processes (Dr. K. Kuhmann)
17:10
Evaluation of different additive manufacturing technologies for MIDs in the context of smart sensor systems for retrofit applications, F. Hemmelgarn, Fraunhofer IEM, DE
17:35
Development of an additive manufactured 3D-circuit carrier made of ceramic for contacting and integration of power electronics by using low-resistance active solder, M. Rosen, KIT, DE
18:00
Novel manufacturing process for the additive production of 3D MID components using stereolithographic printing, T. Mager, Fraunhofer IEM, DE
10:00
Industrieausstellung
13:00
Pause
14:00
Rapid-Networking
7. Sitzung: Industrial Application III (J. Obermaier)
14:30
Potential of Additive Manufacturing (AM) in electronic production, M. Schleicher, SEMIKRON, DE
14:55
Printed Electronics Design Challenges, A. Becerra Esteban, Altium Europe, DE
15:20
Pause
8. Sitzung: 3D Optoelectronics I (Prof. A. Zimmermann)
15:25
Conditioning of Flexible Substrates for the Application of Polymer Optical Waveguides,
G.-A. Hoffmann, LUH – ITA, DE
15:50
Surface Functionalization of Flexographic Printing Forms for Wetting Behavior Adjustment,
A. Wienke, LZH, DE
16:15
Fabrication of Polymer Optical Waveguides via Aerosol Jet Printing, M. Khairulamzari Hamjah, FAU – FAPS, DE
16:40
Pause
9. Sitzung: 3D Optoelectronics II (Dr. A. Pojitinger)
16:45
Asymmetric Optical Bus Coupling Using 3D-Opto-MID, Dr. L. Lorenz, TU Dresden – IAV, DE
17:10
Computer Aided Design and Modeling of 3D-Opto-MID, J. Zeitler, Neotech, DE
17:35
Simulation Analysis of 3D Printed Polymer Optical Waveguides, C. Backhaus, FAU – ODEM, DE
10:00
Industrieausstellung
13:00
Pause
14:00
Rapid-Networking
10. Sitzung: Industrial Application IV (H. Rohde)
14:30
Development of EMC for LDS MID that enables high-density 3D semiconductor packages and high-speed signal transmission modules, M. Endo, Sumitomo, JP
14:55
Active Mold Packaging – A D-Band mmWave-Frequency Dielectric Characterization, F. Roick, LPKF, DE
15:20
Electronics go 3D, W. Mildner, MSWtech, DE
15:45
Pause
11. Sitzung: Packaging and Integration (Dr. R. Krüger)
15:45
3D Conductive Tracks on Thermoset Packages for Advanced System Integration, S. Petillon, Hahn-Schickard, DE
16:15
Assembly and encapsulation of LED modules on a mechanical flexible textile wound dressing for blue light therapy, F. Janek, Hahn-Schickard, DE
16:40
Pause
12. Sitzung: Printed Electronics (W. Mildner)
16:45
Sintering of printed conductive structures by using microwave irradiation for the application of energy, Dr. L. Hartmann, Fraunhofer IAP, DE
17:10
New approach to the characterization of printed electronics and the homogeneity of sintering using RF, S. Neermann, FAU – FAPS, DE
17:35
Sintering of digitally printed silver nanoparticle inks on flexible and rigid substrates by NIR- and UV-radiation, J. Roudenko, TH Nürnberg, DE
18:00
Abschließende Worte & Auszeichnung für das beste Paper, Prof. J. Franke, FAU Erlangen-Nürnberg– FAPS / Vorstandsvorsitzender des 3-D MID e.V., DE