Joint booth of the network 3-D MID e.V. at productronica 2017
14th – 17th November 2017, Messe Munich,
Hall B3, booth 381
The MID technology (MID – Mechatronic Integrated Devices) offers a wide range of possibilities to meet the increasing demands of the markets for the miniaturization and the increasing functional density of mechatronic systems. In times of the Internet of Things (IoT), cross-industry applications such as sensor functions, electronic intelligence, energy storage and communication facilities (e.g. antennas) must be able to be integrated into tightest installation spaces on every material. These constraints form the ideal breeding ground for mechatronic integrated assemblies, in the context of the consistent further development of the structuring, metallization and printing processes.
Picture 1: The process chain for the production of mechatronic integrated modules is shown by a series of technologically clustered monitors via image and video sequences.
Highlight of this year’s trade fair activities of the Research Association 3-D MID community will be the joint booth of the Research Association 3-D MID community with its members on the worlds leading trade fair for development and production of electronic assembly – the productronica 2017. From the 14th to 17th November, the productronica offers an ideal platform for presenting the various potentials of MID technology to the international experts from industry, business and research. The integration into the Cluster PCB & EMS, which covers the areas of circuit board manufacturing, circuit carrier manufacturing and electronic manufacturing services, allows the co-exhibitors to present a targeted presentation of their latest production solutions and services. The entire process chain for the production of mechatronic integrated modules is represented by means of image and video sequences, transported through a novel booth concept with the focus on “community booth”. Six technologically clustered monitors, which are additionally illustrated with corresponding exhibits in showcases underneath, function as a mouthpiece. The allocation of the co-exhibitors to the monitors is based on their content.
Exhibiting companies and institutes
At the joint booth of the MID network (Booth B3.381), 11 companies and institutes from all fields of interdisciplinary technology provide information on the latest state of the art, new serial applications as well as the possibilities for prototyping.
- Research Association 3-D MID e.V.
- 2E mechatronic GmbH & Co. KG
- Beta LAYOUT GmbH
- Evonik Industries AG
- Hahn-Schickard-community for applied research e.V.
- LPKF Laser & Electronics AG
- MacDermid Enthone Electronics Solutions
- MEP Europe B.V.
- MID Solutions GmbH
- TEPROSA GmbH
- University Erlangen-Nürnberg, Institute for Factory Automation and Production Systems (FAPS)
As part of the trade show at productronica, the Research Association for Mechatronic Integrated Devices 3-D MID e.V. is awarding the MID Industry Prize this year for the eleventh time. Since 1997, this award acknowledges directive, innovative products in the field of mechatronic integrated devices every two years. The award ceremony will take place on 16th November 2017 at the joint booth of the Network 3-D MID.