Forschungsvereinigung Räumliche Elektronische Baugruppen 3-D MID e.V.
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3-D MID e.V. at electronica 2020

10 to 13 November 2020, Messe München

Following its successful appearance at electronica 2018, the research association is also presenting itself at this year’s electronica 2020 in Munich with a joint stand.

Several companies and institutes from all areas of MID technology have already registered for the joint stand. However, the Research Association is looking forward to further booth participations of its members. For details please contact the office of the Research Association. Please do not hesitate to contact us. Email to office

The world’s leading trade fair for components, systems and applications of electronics will take place in Munich from November 10th to 13th 2020. In 2018, more than 3,100 exhibitors from 53 countries presented themselves and welcomed more than 81,000 visitors. The organizers expect a considerable increase in visitor numbers and exhibitors this year as well.

The novel, openly designed stand concept of the Research Association for Spatial Electronic Devices 3-D MID e.V. was well received by exhibitors and visitors alike in 2018 and will be used again in 2020. With six technologically grouped monitors, the entire process chain for the production of mechatronically integrated assemblies was presented using image and video sequences. In addition, the potential of MID technology was illustrated by numerous exhibits from series production.

Bild 1: 3D-MID Messestand bei der electronica 2018 Quelle: 3D-MID e.V.
Picture 1: 3D-MID booth at electronica 2018
Source: 3D-MID e.V.

These companies have already registered for the joint stand 2020:  

Name Logo
Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
2E Mechatronic GmbH & Co. KG
Ensinger Sintimid GmbH
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik der FAU (FAPS)

Past eletronica trade fair appearances

13 to 16 November 2018, Messe München,

Hall A1, booth 443


In addition to the MID Congress, the participation with a joint booth at the electronica 2018, the world’s leading trade fair for components, systems and applications of electronics in Munich, represents another highlight of this year’s activities of the Research Association 3-D MID e.V.

The joint booth was a huge success. Due to the broad technical line-up of the ten co-exhibitors, a suitable contact person could be found at the booth for every technical question. Visitors’ interest in the Research Association and technology clearly showed that MID technology is still of great importance to the industrial market. Over 200 contact details were recorded. In addition, promising projects and research projects were discussed.

Exhibiting companies and institutes


The following institutes and companies from all areas of interdisciplinary technology were represented at the joint booth:


  • Research Association 3-D MID e.V.
  • 2E mechatronic GmbH & Co. KG
  • Ensinger Sintimid GmbH
  • Hahn-Schickard-Gesellschaft für angewandte Forschung e.V.
  • LPKF Laser & Electronics AG
  • MacDermid Enthone Electronics Solutions
  • MEP Europe B.V.
  • MID Solutions GmbH
  • University Erlangen-Nürnberg, FAPS – Institute for Factory Automation and Production Systems (FAPS)


The joint booth


Due to the success at productronica 2017, the booth concept was also adopted for electronica 2018. In order to visualize the process chain for the production of molded interconnect devices to visitors, they are represented by means of image and video sequences and supported by the technologically appropriate exhibits of the co-exhibitors in the showcases below.

Unser Flyer für unseren Messeauftritt

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